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參數(shù)資料
| 型號： | MF1ICS5005W1D |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Standard Card IC Specification “bumped sawn wafer on UV-tape” |
| 中文描述： | 標準卡IC規(guī)范“撞鋸晶圓紫外線磁帶” |
| 文件頁數(shù)： | 7/7頁 |
| 文件大小： | 45K |
| 代理商： | MF1ICS5005W1D |
Philips Semiconductors - a worldwide company
Contact Information
For additional information please visit
http://www.semiconductors.philips.com
.Fax:
+31 40 27 24825
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com
.
Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without any notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
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Philips
Semiconductors
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MF1ICS5007W/V6D,00 | 功能描述:RFID應答器 CONTACTLESS SMART CARD CHIP RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF1ICS5007W/V7D,00 | 功能描述:RFID應答器 MF1ICS5007W/UNCASED/FOIL//V7D RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF1ICS70 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Functional specification Public transportation |
| MF1ICS70_10 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Functional specification Public transportation |
| MF1ICS7001 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Standard 4Kbyte card IC sawn wafer on UV-tape addendum |
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