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參數(shù)資料
| 型號： | MF1ICS5005W1D |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Standard Card IC Specification “bumped sawn wafer on UV-tape” |
| 中文描述： | 標(biāo)準(zhǔn)卡IC規(guī)范“撞鋸晶圓紫外線磁帶” |
| 文件頁數(shù)： | 5/7頁 |
| 文件大小： | 45K |
| 代理商： | MF1ICS5005W1D |
Philips Semiconductors
Product Specification Rev. 3.0 August 2004
Bumped sawn wafer on UV-tape
Standard Card IC MF1 IC S50 05
5
PUBLIC
6 ELECTRICAL SPECIFICATIONS
6.1 Absolute Maximum Ratings
SYMBOL
I
IN
P
TOT
T
STOR
T
OP
V
ESD
I
LU
PARAMETER
input current
total power dissipation
storage temperature
operating temperature
electrostatic discharge voltage
2
LA-LB
latchup current
MIN
-
-
-55
-25
2
±
100
MAX
30
200
125
70
-
UNIT
mA
mW
°C
°C
kV
mA
6.2 AC Characteristics
SYMBOL
f
IN
C
IN
PARAMETER
input frequency
Input capacitance
(LCR meter HP4258)
EEPROM write time
EEPROM data retention
EEPROM write
endurance
CONDITIONS
MIN
-
14.4
TYP
13.56
16.1
MAX
-
17.4
UNIT
MHz
pF
22°C, Cp-D,
13.56 MHz, 2 V
t
W
t
RET
N
WE
-
2.9
-
ms
years
cycles
10
10
5
2
MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 k
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