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參數資料
| 型號： | MF1ICS5005W1D |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Standard Card IC Specification “bumped sawn wafer on UV-tape” |
| 中文描述： | 標準卡IC規(guī)范“撞鋸晶圓紫外線磁帶” |
| 文件頁數： | 4/7頁 |
| 文件大?。?/td> | 45K |
| 代理商： | MF1ICS5005W1D |
Philips Semiconductors
Product Specification Rev. 3.0 August 2004
Bumped sawn wafer on UV-tape
Standard Card IC MF1 IC S50 05
4
PUBLIC
5 CHIP ORIENTATION AND BONDPAD LOCATIONS
PAD(center) x [μm]
VSS
TESTIO
LA
LB
y [μm]
0.0
602.3
596.1
0.0
0.0
252.2
17.4
712.4
(1) X-Scribeline width:
(2) Y-Scribeline width:
(3) Chip step, x-length:
(4) Chip step, y-length:
91.2 μm
91.2 μm
1.11 mm
1.06 mm
(5) LA bump edge to chip edge, y-length: 106.5 μm
(6) LA bump edge to chip edge, x-length: 103.0 μm
(7) LB bump edge to chip edge, y-length: 133.4 μm
(8) LB bump edge to chip edge, x-length:
88.6 μm
Figure 1
(1)
X
Y
LA
TESTIO
VSS
LB
MF1ICS5005
(4)
(3)
(5)
(6)
(2)
(7)
(8)
Widths and lengths are measured from metal to metal.
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