參數(shù)資料
型號: MCZ33780EGR2
廠商: Freescale Semiconductor
文件頁數(shù): 32/37頁
文件大?。?/td> 0K
描述: IC MASTER DUAL DBUS DIFF 16-SOIC
標(biāo)準(zhǔn)包裝: 1,000
系列: *
應(yīng)用: *
接口: *
電源電壓: *
封裝/外殼: 16-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC W
包裝: 帶卷 (TR)
安裝類型: 表面貼裝
Analog Integrated Circuit Device Data
4
Freescale Semiconductor
33780
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltages
VSUP
Load Dump VSUP (300 ms maximum)
VCC
VSUP
VSUPLD
VCC
-0.3 to 26.5
40
-0.3 to 7.0
V
Maximum Voltage on Logic Input/Output Pins
-0.3 to VCC + 0.3
V
Maximum Voltage on DBUS Pins
VDBUS
-0.3 to VSUP + 0.3
V
Maximum DBUS Pin Current
IDBUS
400
mA
Maximum Logic Pin Current
ILOGIC
20
mA
ESD Voltage 1
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
VESD
±2000
±200
±750 for corner pins
±500 for others
V
THERMAL RATINGS
Storage Temperature
TSTG
-55 to 150
°C
Operating Ambient Temperature
TA
-40 to 85
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Thermal Shutdown
TSD
155 to 190
°C
Resistance, Junction-to-Ambient
RΘJA
109
°C/W
Resistance, Junction-to-Board
RΘJB
50
°C/W
Peak Package Reflow Temperature During Reflow (2), (3)
TPPRT
°C
Notes
1.
ESD1 testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 ); ESD2 testing is
performed in accordance with the Machine Model (MM) (CZAP = 200 pF, RZAP = 0 ); and Charge Body Model (CBM).
2.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3.
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