參數(shù)資料
型號(hào)： MCZ33742SEGR2
廠(chǎng)商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
元件分類(lèi)： CAN
英文描述： System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver
中文描述： 系統(tǒng)基礎(chǔ)芯片的增強(qiáng)型（SBC）的高速CAN收發(fā)器
文件頁(yè)數(shù)： 61/65頁(yè)
文件大?。?/td> 1158K
代理商： MCZ33742SEGR2
Analog Integrated Circuit Device Data
Freescale Semiconductor
61
33742
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33742
technical datasheet. The addendum provides thermal performance
information that may be critical in the design and development of system
applications. All electrical, application, and packaging information is
provided in the data sheet.
Packaging and Thermal Considerations
The MC33742 is offered in a 28 pin SOICW exposed pad, single die
package. There is a single heat source (P), a single junction temperature
(T
J
), and thermal resistance (R
θ
JA
).
The stated values are solely for a thermal performance comparison of
one package to another in a standardized environment. This methodology
is not meant to and will not predict the performance of a package in an
application-specific environment. Stated values were obtained by
measurement and simulation according to the standards listed below.
Standards
Figure 38. Surface Mount for SOIC Wide Body
non-Exposed Pad
28-PIN
SOICW
33742DW
33742EG
DW SUFFIX
EG SUFFIX (PB-FREE)
98ASB42345B
28-PIN SOICW
Note For package dimensions, refer to
the 33742 data sheet.
T
J
=
R
θ
JA
.
P
Table 43. Thermal Performance Comparison
Thermal Resistance
[
°
C/W]
R
θ
JA
(1)
(2)
41
R
θ
JB
(2)
(3)
10
R
θ
JA
(1)
(4)
68
R
θ
JC
(5)
220
Notes:
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2s2p thermal test board per JEDEC JESD51-7.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
Single layer thermal test board per JEDEC JESD51-3.
Thermal resistance between the die junction and the
package top surface; cold plate attached to the package top
surface and remaining surfaces insulated.
2.
3.
4.
5.
1.0
1.0
0.2
0.2
* All measurements
are in millimeters
28 Pin SOICW
1.27 mm Pitch
16.0 mm x 7.5 mm Body
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