參數(shù)資料
型號: MAX8632
廠商: Maxim Integrated Products, Inc.
英文描述: Quadruple 2-Input Positive-NAND Gates With Open-Drain Outputs 20-LCCC -55 to 125
中文描述: 集成DDR電源方案,適用于臺式機、筆記本電腦和圖形卡
文件頁數(shù): 2/29頁
文件大?。?/td> 512K
代理商: MAX8632
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
MAIN PWM CONTROLLER
V
IN
2
28
5.5
5.5
0.707
2.53
1.82
Input Voltage Range
V
DD
, AV
DD
V
OUT
4.5
0.7
0.693
2.47
1.78
V
Output Adjust Range
V
FB = OUT
FB = GND
FB = V
DD
Rising edge of
SHDN
to full current limit
0.7
2.5
1.8
1.7
194
243
352
516
300
25
1
2.5
1
Output Voltage Accuracy
(Note 2)
V
Soft-Start Ramp Time
t
SS
ms
TON = GND (600kHz)
TON = REF (450kHz)
TON = open (300kHz)
TON = AV
DD
(200kHz)
170
213
316
461
200
219
273
389
571
450
40
5
5
2
On-Time
t
ON
V
IN
= 15V,
V
OUT
= 1.5V
(Note 3)
ns
Minimum Off-Time
V
IN
Quiescent Supply Current
V
IN
Shutdown Supply Current
t
OFF_MIN
I
IN
(Note 3)
ns
μA
μA
SHDN
= GND
All on (PWM, VTT, and VTTR on)
STBY
= GND (only VTTR and PWM on)
AV
DD
Quiescent Supply Current
I
AVDD
mA
AV
DD
+ V
DD
Shutdown Supply
Current
SHDN
= GND
20
μA
Rising edge of V
IN
Hysteresis
Set V
FB
= 0.8V
4.05
4.25
50
1
4.40
V
AV
DD
Undervoltage-Lockout
Threshold
mV
μA
V
DD
Quiescent Supply Current
I
VDD
5
M
Integrated DDR Power-Supply Solution for
Desktops, Notebooks, and Graphic Cards
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
V
IN
to GND .............................................................-0.3V to +30V
V
DD,
AV
DD
, VTTI to GND.........................................-0.3V to +6V
SHDN
, REFIN to GND ..............................................-0.3V to +6V
SS, POK1, POK2,
SKIP
, ILIM, FB to GND................-0.3V to +6V
STBY
, TON, REF, UVP/OVP to GND........-0.3V to (AV
DD
+ 0.3V)
OUT, VTTR to GND..................................-0.3V to (AV
DD
+ 0.3V)
DL to PGND1..............................................-0.3V to (V
DD
+ 0.3V)
DH to LX....................................................-0.3V to (V
BST
+ 0.3V)
LX to BST..................................................................-6V to +0.3V
LX to GND .................................................................-2V to +30V
VTT to GND...............................................-0.3V to (V
VTTI
+ 0.3V)
ELECTRICAL CHARACTERISTICS
(V
IN
= +15V, V
DD
= AV
DD
= V
SHDN
=
STBY
= V
BST
= V
ILIM
= 5V, V
OUT
= V
REFIN
= V
VTTI
= 2.5V, UVP/OVP = TP0 = FB =
SKIP
= GND, PGND1 = PGND2 = LX = GND, TON = OPEN, V
VTTS
= V
VTT
, T
A
= -40°C to +85°C, unless otherwise noted. Typical values
are at T
A
= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VTTS to GND............................................-0.3V to (AV
DD
+ 0.3V)
PGND1, PGND2, TP0 to GND...............................-0.3V to +0.3V
REF Short Circuit to GND...........................................Continuous
Continuous Power Dissipation (T
A
= +70°C)
28-Pin 5mm x 5mm Thin QFN (derate 35.7mW/°C
above +70°C).................................................................2.86W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
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