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參數(shù)資料
| 型號： | MAX1364MEUB+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 12/25頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SYSTEM MON 12BIT 4CH 10-UMAX |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 2,500 |
| 位數(shù)： | 12 |
| 采樣率（每秒）： | 133k |
| 數(shù)據(jù)接口： | I²C，串行 |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 功率耗散（最大）： | 444.4mW |
| 電壓電源： | 單電源 |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-TFSOP，10-MSOP（0.118"，3.00mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 10-µMAX |
| 包裝： | 帶卷 (TR) |
| 輸入數(shù)目和類型： | 4 個單端，單極；4 個單端，雙極；2 個差分，單極；2 個差分，雙極 |
MAX1363/MAX1364
4-Channel, 12-Bit System Monitors with Programmable
Trip Window and SMBus Alert Response
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = 2.7V to 3.6V (MAX1363), VDD = 4.5V to 5.5V (MAX1364), VREF = 2.048V (MAX1363), VREF = 4.096V (MAX1364), CREF =
0.1F, fSCL = 1.7MHz, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND ..............................................................-0.3V to +6V
AIN0–AIN3, A0, REF to GND......................-0.3V to (VDD + 0.3V)
SDA, SCL,
INT to GND .............................................-0.3V to +6V
Maximum Current Into Any Pin .........................................±50mA
Continuous Power Dissipation (TA = +70°C)
10-Pin MAX (derate 5.6mW/°C above +70°C) ........444.4mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY (fSAMPLE = 94.4ksps) (Note 1)
Resolution
12
Bits
Relative Accuracy
INL
(Note 2)
±1
LSB
Differential Nonlinearity
DNL
No missing codes
±1
LSB
Offset Error
±4
LSB
Offset-Error Temperature
Coefficient
Relative to FSR
0.3
ppm/
°C
Gain Error
(Note 3)
±4
LSB
Gain Temperature Coefficient
Relative to FSR
0.3
ppm/
°C
Channel-to-Channel Offset
Matching
±0.1
LSB
Channel-to-Channel Gain
Matching
±0.1
LSB
DYNAMIC PERFORMANCE (fIN(SINE-WAVE) = 10kHz, VIN(P-P) = VREF, fSAMPLE = 94.4ksps)
Signal-to-Noise Plus Distortion
SINAD
70
dB
Total Harmonic Distortion
THD
Up to the 5th harmonic
-78
dB
Spurious-Free Dynamic Range
SFDR
78
dB
Full-Power Bandwidth
SINAD > 57dB
3.0
MHz
Full-Linear Bandwidth
-3dB point
5.0
MHz
CONVERSION RATE
Internal clock
7.5
Conversion Time (Note 4)
tCONV
External clock
10.6
s
Internal clock, SCAN[1:0] = 01
51
External clock
94.4
Throughput Rate (Note 5)
fSAMPLE
Monitor mode, SCAN[1:0] = 10
133
ksps
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