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參數(shù)資料
| 型號： | MAAMGM0007-DIE |
| 元件分類： | 放大器 |
| 英文描述： | 2000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 0.118 X 0.065 INCH, 0 003 INCH HEIGHT, DIE |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 318K |
| 代理商： | MAAMGM0007-DIE |
2.0-18.0 GHz Distributed Amp/Gain Block
MAAMGM0007-DIE
RO-P-DS-3084 A
6/6
Specifications subject to change without notice.
Email: macom_adbu_ics@tycoelectronics.com
North America: Tel. (800) 366-2266
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Figure 9. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW testing.
Refer to table below for bonding to achieve desired operation.
RF
IN
RF
OUT
0.1
F
V
DD
GN
D
:G
GND:G
IN
GN
D
:G
GN
D
:G
GND:G
GN
D
:G
GND:G
G
ND:
G
GND:G
GN
D
:G
G
N
D
: G
OUT
GND:G
G
ND:
G
N
D
: G
GN
D
:G
G
N
D
: G
VD_5
GN
D
:G
GND:G
GN
D
:G
VD_8
VD_7
VD_6
100 pF
Drain Voltage to Pad Connection
Applied Voltage
(Volts)
Operational Voltage
(Volts)
5 Volt Supply: VD_5
4
5
6
4
5
6
6 Volt Supply: VD_6
6
5
7 Volt Supply: VD_7
7
5
8 Volt Supply: VD_8
8
5
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