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參數(shù)資料
| 型號(hào)： | M14C64 |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | Memory Card IC 64/32 Kbit Serial IC Bus EEPROM |
| 中文描述： | 記憶卡IC 64/32千位串行IC總線的EEPROM |
| 文件頁(yè)數(shù)： | 12/14頁(yè) |
| 文件大?。?/td> | 126K |
| 代理商： | M14C64 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)當(dāng)前第12頁(yè)第13頁(yè)第14頁(yè)
M14C64, M14C32
12/14
Table 11. Ordering Information Scheme
Example 1:
M14C64
-
W
D22
Memory Capacity
Delivery Form
64
64 Kbit
D22
Module on Super 35 mm
film (M14C64 only)
32
32 Kbit
D20
Module on Super 35 mm
film (M14C32 only)
Operating Voltage
W
2.5 V to 5.5 V
Example 2:
M14C32
-
W
W2
Memory Capacity
Delivery Form
32
32 Kbit
W2
Unsawn wafer (275
μ
m ±
25
μ
m thickness)
Unsawn wafer (180
μ
m ±
15
μ
m thickness)
W4
Operating Voltage
W
2.5 V to 5.5 V
S2x
Sawn wafer (275
μ
m ± 25
μ
m thickness)
Sawn wafer (180
μ
m ± 15
μ
m thickness)
S4x
where “x” indicates the sawing orientation, as follows (and as shown in Figure 12)
1
GND at top right
2
GND at bottom right
3
GND at bottom left
4
GND at top left
ORDERING INFORMATION
Devices are shipped from the factory with the
memory content set at all ‘1’s (FFh).
The notation used for the device number is as
shown in Table 11. For a list of available options
(speed, package, etc.) or for further information on
any aspect of this device, please contact the ST
Sales Office nearest to you.
Sawn wafers are scribed and mounted in a frame
on adhesive tape. The orientation is defined by the
position of the GND pad on the die, viewed with
active area of product visible, relative to the notch-
es of the frame (as shown in Figure 12). The orien-
tation of the die with respect to the plastic frame
notches is specified by the Customer.
One further concern, when specifying devices to
be delivered in this form, is that wafers mounted
on adhesive tape must be used within a limited pe-
riod from the mounting date:
– two months, if wafers are stored at 25°C, 55%
relative humidity
– six months, if wafers are stored at 4°C, 55% rel-
ative humidity
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