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參數(shù)資料
| 型號： | ISP1130 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Universal Serial Bus compound hub with integrated keyboard controller |
| 中文描述： | 通用串行總線控制器與集成鍵盤復(fù)合樞紐 |
| 文件頁數(shù)： | 64/68頁 |
| 文件大?。?/td> | 1786K |
| 代理商： | ISP1130 |
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Philips Semiconductors
ISP1130
USB compound hub with keyboard controller
Objective specification
Rev. 01 — 23 March 2000
64 of 68
9397 750 06895
Philips Electronics N.V. 2000. All rights reserved.
20.4 Package related soldering information
[1]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[2]
[3]
[4]
[5]
[6]
Table 93: Suitability of IC packages for wave, reflow and dipping soldering methods
Mounting
Package
Soldering method
Wave
Reflow
[1]
Dipping
Through-hole
mount
Surface mount
DBS, DIP, HDIP, SDIP, SIL suitable
[2]
suitable
BGA, LFBGA, SQFP,
TFBGA
HBCC, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP,
SMS
PLCC
[4]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
suitable
not suitable
[3]
suitable
suitable
not recommended
[4] [5]
suitable
not recommended
[6]
suitable
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1130DL | Universal Serial Bus compound hub with integrated keyboard controller |
| ISP1130N | Universal Serial Bus compound hub with integrated keyboard controller |
| ISP1160 | Embedded Universal Serial Bus Host Controller |
| ISP1160BD | Embedded Universal Serial Bus Host Controller |
| ISP1160BM | Embedded Universal Serial Bus Host Controller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1130DL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus compound hub with integrated keyboard controller |
| ISP1130N | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus compound hub with integrated keyboard controller |
| ISP1160 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Embedded Universal Serial Bus Host Controller |
| ISP1160BD | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Embedded Universal Serial Bus Host Controller |
| ISP1160BD,157 | 功能描述:USB 接口集成電路 USB 1.1 HOST CONTROLLER RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
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