參數(shù)資料
型號: IRFR5505
廠商: International Rectifier
英文描述: P Channel Surface Mount HEXFET Power MOSFET(P溝道表貼型HEXFET功率MOS場效應(yīng)管)
中文描述: P通道表面貼裝HEXFET功率MOSFET的性(P溝道表貼型的HEXFET功率馬鞍山場效應(yīng)管)
文件頁數(shù): 2/10頁
文件大小: 108K
代理商: IRFR5505
IRFR/U5505
Parameter
Min. Typ. Max. Units
-55
–––
––– -0.049 –––
–––
–––
-2.0
–––
4.2
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
12
–––
28
–––
20
–––
16
Conditions
V
GS
= 0V, I
D
= -250μA
Reference to 25°C, I
D
= -1mA
V
GS
= -10V, I
D
= -9.6A
V
DS
= V
GS
, I
D
= -250μA
V
DS
= -25V, I
D
= -9.6A
V
DS
= -55V, V
GS
= 0V
V
DS
= -44V, V
GS
= 0V, T
J
= 150°C
V
GS
= 20V
V
GS
= -20V
I
D
= -9.6A
V
DS
= -44V
V
GS
= -10V, See Fig. 6 and 13
V
DD
= -28V
I
D
= -9.6A
R
G
= 2.6
R
D
= 2.8
,
See Fig. 10
Between lead,
6mm (0.25in.)
from package
and center of die contact
V
GS
= 0V
V
DS
= -25V
= 1.0MHz, See Fig. 5
V
(BR)DSS
V
(BR)DSS
/
T
J
Breakdown Voltage Temp. Coefficient
R
DS(on)
Static Drain-to-Source On-Resistance
V
GS(th)
Gate Threshold Voltage
g
fs
Forward Transconductance
Drain-to-Source Breakdown Voltage
–––
V
V/°C
V
S
0.11
-4.0
–––
-25
-250
-100
100
32
7.1
15
–––
–––
–––
–––
μA
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
nA
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
nC
–––
–––
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
650
270
120
–––
–––
–––
pF
nH
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
L
D
Internal Drain Inductance
L
S
Internal Source Inductance
–––
–––
I
GSS
ns
4.5
7.5
I
DSS
Drain-to-Source Leakage Current
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
I
S
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
J
= 25°C, I
S
= -9.6A, V
GS
= 0V
T
J
= 25°C, I
F
= -9.6A
di/dt = 100A/μs
–––
–––
I
SM
–––
–––
V
SD
t
rr
Q
rr
t
on
–––
–––
–––
–––
51
110
-1.6
77
160
V
ns
nC
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
-18
-64
A
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
This is applied for I-PAK, L
S
of D-PAK is measured between
lead and center of die contact
Starting T
J
= 25°C, L = 3.2mH
R
G
= 25
, I
AS
= -9.6A. (See Figure 12)
I
SD
-9.6A, di/dt
290A/μs, V
DD
V
(BR)DSS
,
T
J
150°C
Pulse width
300μs; duty cycle
2%.
S
D
G
S
D
G
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