參數資料
型號: IDT88P8344BHI
廠商: IDT, Integrated Device Technology Inc
文件頁數: 94/98頁
文件大?。?/td> 0K
描述: IC SPI3-SPI4 EXCHANGE 820-PBGA
標準包裝: 24
系列: *
其它名稱: 88P8344BHI
94
IDT88P8344 SPI EXCHANGE 4 x SPI-3 TO SPI-4
INDUSTRIALTEMPERATURERANGE
APRIL 10, 2006
12.3 Device package
The SPI Exchange IDT88P8344 device is packaged in a 35 mm by 35 mm
820-ball one millimeter ball pitch thermally-enhanced plastic ball grid array. All
balls, whether used or unused, must be soldered to pads.
Figure 42. IDT88P8344 820PBGA package, bottom view
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