Internet Data Sheet
Rev. 1.2, 2007-01
03292006-AYVF-ZIIJ
4
HYS72T[512/256]02xHR–[3S/3.7/5]–A
Registered DDR2 SDRAM Modules
1.2
Description
The
module family are Registered DIMM modules “RDIMMs” with
30 mm height based on DDR2 technology. DIMMs are
available as ECC modules in 256M
×
72 (2 GByte),
512M
×
72 (4 GByte) organization and density, intended for
mounting into 240-Pin connector sockets.
The memory array is designed with stacked 1-Gbit Double-
Data-Rate-Two (DDR2) Synchronous DRAMs. All control and
address signals are re-driven on the DIMM using register
devices and a PLL for the clock distribution. This reduces
QIMONDA
HYS72T[512/256]02xHR–[3S/3.7/5]–A
capacitive loading to the system bus, but adds one cycle to
the SDRAM timing. Decoupling capacitors are mounted on
the PCB board. The DIMMs feature serial presence detect
based on a serial E
2
PROM device using the 2-pin I
2
C
protocol. The first 128 bytes are programmed with
configuration data and the second 128 bytes are available to
the customer.
TABLE 2
Ordering Information for RoHS Compliant Products
TABLE 3
Address Format
TABLE 4
Components on Modules
Product Type
1)
1) All Product Type numbers end with a place code, designating the silicon die revision. Example: HYS72T512022HR–3.7–A, indicating Rev.
“A” dies are used for DDR2 SDRAM components. For all QIMONDA DDR2 module and component nomenclature see
Chapter 6
of this
data sheet.
2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200R–444–12–D0”, where
4200R means Registered DIMM modules with 4.26 GB/sec Module Bandwidth and “444-11” means Column Address Strobe (CAS) latency
= 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.2 and produced
on the Raw Card “D”
Compliance Code
2)
Description
SDRAM Technology
PC2–5300
HYS72T512022HR–3S–A
PC2–4200
HYS72T512022HR–3.7–A
PC2-3200
HYS72T256023HR–5–A
HYS72T512022HR–5–A
4 GB 2R
×
4 PC2–5300R–555–12–D0
2 Ranks, ECC
1 Gbit (
×
4)
4 GB 2R
×
4 PC2–4200R–444–12–D0
2 Ranks, ECC
1 Gbit (
×
4)
2 GB 2R
×
8 PC2–3200R–333–12–ZZ
4 GB 2R
×
4 PC2–3200R–333–12–D0
2 Ranks, ECC
2 Ranks, ECC
1 Gbit (
×
8)
1 Gbit (
×
4)
DIMM
Density
Module
Organization
Memory
Ranks
ECC/
Non-ECC
# of
SDRAMs
# of row/bank/columns bits
Raw Card
2 GB
4 GB
256M
×
72
512M
×
72
2
2
ECC
ECC
2
×
9
2
×
18
14/3/10
14/3/11
Z
D
Product Type
DRAM Components
DRAM Density
DRAM Organization
Note
1)
1) For a detailed description of all available functions of the DRAM components on these modules see the component data sheet.
HYS72T256023HR
HYS72T512022HR
HYB18T2G802AF
HYB18T2G402AF
2 Gbit
2 Gbit
2
×
128M
×
8
2
×
256M
×
4