參數(shù)資料
型號: HPA00002DTR
廠商: Texas Instruments, Inc.
英文描述: LOW POWER CURRENT MODE PUSH-PULL PWM
中文描述: 低功耗電流模式推拉脈寬調(diào)制
文件頁數(shù): 2/10頁
文件大?。?/td> 174K
代理商: HPA00002DTR
SLUS168D
APRIL 1999
REVISED AUGUST 2002
2
www.ti.com
description (continued)
The UCC3808 family offers a variety of package temperature range options, and choice of undervoltage lockout
levels. The family has UVLO thresholds and hysteresis options for off-line and battery powered systems. Thresholds
are shown in the table below.
Table 1.
Part Number
Turn on Threshold
Turn off Threshold
UCCx808
1
12.5 V
8.3 V
UCCx808
2
4.3 V
4.1 V
ORDERING INFORMATION
TA = TJ
Packaged Devices
SOIC (D)
UCC2808D
1
UVLO Option
12.5 V/8.3 V
PDIP (N)
UCC2808N
1
TSSOP (PW)
UCC2808PW
1
40
°
C to 85
°
C
4.3 V/4.1 V
UCC2808D
2
UCC2808N
2
UCC2808PW
2
0
°
C to 70
°
C
12.5 V/8.3 V
UCC3808D
1
UCC3808N
1
UCC3808PW
1
4.3 V/4.1 V
UCC3808D
2
UCC3808N
2
UCC3808PW
2
D (SOIC
8) and PW (TSSOP
8) packages are available taped and reeled. Add TR suffix to device type (e.g.
UCC3808DTR
1) to order quantities of 2500 devices per reel for SOIC-8 and 2000 devices per reel for TSSOP-8.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage (IDD
10 mA)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply current
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OUTA/OUTB source current (peak)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OUTA/OUTB sink current (peak)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog inputs (FB, CS)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power dissipation at T
A
= 25
°
C (N Package)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power dissipation at T
A
= 25
°
C (D Package)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power dissipation at T
A
= 25
°
C (PW Package)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature,
Tstg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Junction temperature, T
J
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 10 sec.)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15 V
20 mA
0.5 A
1.0 A
0.3 V to VDD+0.3 V, not to exceed 6 V
1 W
650 mW
400 mW
65
°
C to 150
°
C
55
°
C to 150
°
C
300
°
C
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under
recommended operating conditions
is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the
Power Supply Control Data Book (TI Literature
Number SLUD003)
for thermal limitations and considerations of packages.
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