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參數(shù)資料
| 型號： | HMMC-5620 |
| 元件分類： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | CHIP |
| 文件頁數(shù)： | 4/6頁 |
| 文件大?。?/td> | 128K |
| 代理商： | HMMC-5620 |
6-73
Figure 2. HMMC-5620 Bonding Pad Locations.
Figure 3. HMMC-5620 Assembly Diagram. (For 6.0 – 20.0 GHz Operation)
L
≥2 nH
(1.0 mil Gold Wire Bond
with length
≥100 mils)
Gold Plated Shim
68 pF Chip Capacitor
Input and Output Thin Film
Circuits with 50 ohm transmission
lines. (2 places)
2.0 mil
nom. gap
RF IN
VDD
RF OUT
Notes:
All dimensions in microns.
RF Pad Dim: 80 x 80
m.
VDD Pad Dim: 110 x 90 m
All other dimensions:
±5 m
(unless otherwise noted).
Chip thickness: 127
± 15 m.
RF
Input
Chip ID No.
RF
Output
1010
(
±10)
1410
(
±10)
VDD
875 (VDD Pad)
1325
(RF Output Pad)
85
(RF Input Pad)
910 (Center of VDD Pad)
350
0
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