參數(shù)資料
型號(hào)： HMMC-5004
英文描述： 3 GHz Wideband Power Amplifier(3 GHz寬帶功率放大器)
中文描述： 3 GHz的寬帶功率放大器（3 GHz的寬帶功率放大器）
文件頁(yè)數(shù)： 4/6頁(yè)
文件大?。?/td> 80K
代理商： HMMC-5004
4
Figure 2. HMMC-5004 Bond Pad Locations.
Figure 3. HMMC-5003 Assembly Diagram ( for 10 MHz to 3 GHz Operation) .
To V
D1
supply
To V
D2
supply
To V
D3
supply
25-mil thick input and output thin-film
circuit w/ 4.7 nF monoblock capacitor
4
μ
H wire wound toroidal inductor
25-mil wide (50
) trace
1250 pF Chip Capacitor
HMMC-5004 Pedestal
To V
SS
supply
10 mil nom. gap
≥
50 pF chip cap.
1.5 mil dia gold bond
wire to 15 nF DC feedthru
Note:
All device bonds are 0.7 mil dia.
gold wire.
C
in
C
D1
VD1
IN
VD2
VSS
OUT
TC525
L
D2
C
SS
L
SS
C
Bypass
Component
C
in
, C
out
C
D1
C
SS
C
Bypass
R
L
D2
L
D3
L
SS
External Circuitry Guidelines
[1]
Value
≥
4.7
≥
50
≥
1250
≥
.01
~2.5
≥
4
≥
4
≤
5
Units
nF
pF
pF
μ
F
μ
H
μ
H
nH
C
out
L
D3
10 mil nom. gap
Note 1:
Choose length of LSS bond
such that L
SS
≤
R2C
ss
– (L
R
+ C
LBypass
).
340
455
570
340
75
835
455
200
455
700
1530
±
10
955
1270
910
±
10
700
455
1270
955
330
205
75
Notes:
All dimensions in microns.
Small Pad Dim: 75 x 75
μ
m.
V
SS
Pad Dim: 325 x 75
μ
m.
GND1 & 2 Pad Dim: 320 x 75
μ
m.
GND3 & 4 Pad Dim: 450 x 75
μ
m.
All Tolerances:
±
5
μ
m (unless
otherwise noted).
Chip Thickness: 127
±
15
μ
m.
相關(guān)PDF資料
PDF描述
HMMC-5022 2-22 GHz GaAs MMIC Traveling Wave Amplifier(2-22 GHz砷化鎵單片微波集成電路行波放大器)
HMMC-5026 2-26.5 GHz GaAs MMIC Traveling Wave Amplifier(2-26.5 GHz砷化鎵單片微波集成電路行波放大器)
HMMC-5021 2-22 GHz GaAs MMIC Traveling Wave Amplifier(2-22 GHz砷化鎵單片微波集成電路行波放大器)
HMMC-5023 21.2-26.5 GHz High-Gain Low-Noise Amplifier(21.2-26.5 GHz 高增益低噪聲放大器)
HMMC-5025 2 -50 GHz Wide band Distributed Amplifier(2 -50 GHz寬帶分布式放大器)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HMMC-5021 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GP AMP 22GHZ 8V - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5022 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GP AMP 22GHZ 8V CHIP - Gel-pak, waffle pack, wafer, diced wafer on film 制造商:Agilent Technologies 功能描述:ML-GAAS ATTEN CHIP
HMMC-5023 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GP AMP 26.5GHZ 7V - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5025 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GP AMP 50GHZ 7V - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5026 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GP AMP 26.5GHZ 8V - Gel-pak, waffle pack, wafer, diced wafer on film
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