- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄299163 > GS882Z36BGD-225T (GSI TECHNOLOGY) 256K X 36 ZBT SRAM, 6 ns, PBGA165 PDF資料下載
參數(shù)資料
| 型號(hào)： | GS882Z36BGD-225T |
| 廠商： | GSI TECHNOLOGY |
| 元件分類： | SRAM |
| 英文描述： | 256K X 36 ZBT SRAM, 6 ns, PBGA165 |
| 封裝： | 13 X 15 MM, 1 MM PITCH, FBGA-165 |
| 文件頁(yè)數(shù)： | 8/33頁(yè) |
| 文件大?。?/td> | 1057K |
| 代理商： | GS882Z36BGD-225T |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)當(dāng)前第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)
Rev: 1.00b 12/2002
16/33
2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS882Z18/36BB/D-250/225/200/166/150/133
Note: These parameters are sample tested.
Notes:
1. Junction temperature is a function of SRAM power dissipation, package thermal resistance, mounting board temperature, ambient.
Temperature air flow, board density, and PCB thermal resistance.
2. SCMI G-38-87
3. Average thermal resistance between die and top surface, MIL SPEC-883, Method 1012.1
Recommended Operating Temperatures
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
Ambient Temperature (Commercial Range Versions)
TA
025
70
°C2
Ambient Temperature (Industrial Range Versions)
TA
–40
25
85
°C2
Note:
1.
The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are
evaluated for worst case in the temperature range marked on the device.
2.
Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Capacitance
(TA = 25oC, f = 1 MHZ, VDD = 2.5 V)
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
Input Capacitance
CIN
VIN = 0 V
45
pF
Input/Output Capacitance
CI/O
VOUT = 0 V
67
pF
Package Thermal Characteristics
Rating
Layer Board
Symbol
Max
Unit
Notes
Junction to Ambient (at 200 lfm)
single
RΘJA
40
°C/W
1,2
Junction to Ambient (at 200 lfm)
four
RΘJA
24
°C/W
1,2
Junction to Case (TOP)
—
RΘJC
9
°C/W
3
20% tKC
VSS – 2.0 V
50%
VSS
VIH
Undershoot Measurement and Timing
Overshoot Measurement and Timing
20% tKC
VDD + 2.0 V
50%
VDD
VIL
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| GSCB01C-6Q01 | SNAP ACTING/LIMIT SWITCH, SPDT, MOMENTARY, 0.55A, 125VDC, 17.3mm, PANEL MOUNT-THREADED |
| GSCB03C-6 | SNAP ACTING/LIMIT SWITCH, SPDT, MOMENTARY, 0.55A, 125VDC, 17.3mm, PANEL MOUNT-THREADED |
| GSCB33C-6 | SNAP ACTING/LIMIT SWITCH, SPDT, MOMENTARY, 0.1A, 50VDC, 17.3mm, PANEL MOUNT-THREADED |
| GSCB36C-C021 | SNAP ACTING/LIMIT SWITCH, SPDT, MOMENTARY, 0.1A, 50VDC, 17.3mm, PANEL MOUNT-THREADED |
| GSCB04C-Q04 | SNAP ACTING/LIMIT SWITCH, SPDT, MOMENTARY, 0.55A, 125VDC, 17.3mm, PANEL MOUNT-THREADED |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GS882Z36CB-200V | 制造商:GSI Technology 功能描述:SRAM SYNC SGL 1.8V/2.5V 9MBIT 256KX36 6.5NS/3NS 119FPBGA - Trays |
| GS882Z36CB-250V | 制造商:GSI Technology 功能描述:SRAM SYNC SGL 1.8V/2.5V 9MBIT 256KX36 5.5NS/3NS 119FPBGA - Trays |
| GS882Z36CB-300 | 制造商:GSI Technology 功能描述:SRAM SYNC SGL 2.5V/3.3V 9MBIT 256KX36 5NS/2.5NS 119FPBGA - Trays |
| GS882Z36CD-200I | 制造商:GSI Technology 功能描述:SRAM SYNC SGL 2.5V/3.3V 9MBIT 256KX36 6.5NS/3NS 165FPBGA - Trays |
| GS882Z36CD-200V | 制造商:GSI Technology 功能描述:SRAM SYNC SGL 1.8V/2.5V 9MBIT 256KX36 6.5NS/3NS 165FPBGA - Trays |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。