參數(shù)資料
型號: DAC1617D1G0HN
廠商: NXP Semiconductors N.V.
元件分類: 外設(shè)及接口
英文描述: Dual 16-bit DAC: up to 1 Gsps; x2, x4 and x8 interpolating
封裝: DAC1617D1G0HN/C1<SOT813-3 (HVQFN72)|<<http://www.nxp.com/packages/SOT813-3.html<1<Always Pb-free,;DAC1617D1G0HN/C1<SOT813-3 (HVQFN72)|<<http://www.nxp.com/packages/SOT813
文件頁數(shù): 7/66頁
文件大?。?/td> 519K
代理商: DAC1617D1G0HN
DAC1617D1G0
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Objective data sheet
Rev. 1.1 — 30 September 2011
7 of 66
NXP Semiconductors
DAC1617D1G0
Dual 16-bit DAC: up to 1 Gsps; x2, x4 and x8 interpolating
7. Limiting values
Table 3.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
V
DDA(3V3)
analog supply voltage
(3.3 V)
V
DDD(1V8)
digital supply voltage
(1.8 V)
V
DDA(1V8)
analog supply voltage
(1.8 V)
V
I
input voltage
V
O
output voltage
[1]
Connect the analog 1.8 V power supply to pins VDDA1V8_D, VDDA1V8_P1, and VDDA1V8_P2.
8. Thermal characteristics
Table 4.
Symbol
R
th(j-a)
[1]
Value for six layers board in still air with a minimum of 49 thermal vias.
Limiting values
Conditions
Min
0.5
Max
+4.6
Unit
V
0.5
+2.5
V
[1]
0.5
+2.5
V
input pins referenced to GND
pins IOUTAP, IOUTAN,
IOUTBP, IOUTBN, AUXAP,
AUXAN, AUXBP and AUXBN
referenced to GND
0.5
0.5
+2.5
+4.6
V
V
T
stg
T
amb
T
j
storage temperature
ambient temperature
junction temperature
55
40
40
+150
+85
+125
C
C
C
Thermal characteristics
Parameter
thermal resistance from junction
to ambient
thermal resistance from junction
to case
Conditions
Typ
Unit
K/W
[1]
16.2
R
th(j-c)
[1]
6.7
K/W
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