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BELASIGNA 250
http://onsemi.com
28
Shipping Label Example
Figure 15. Sample Label
Moisture Sensitivity Level
The LFBGA and CABGA package options of
BELASIGNA 250 are MSL JEDEC Level 3.
Reflow Information
The reflow profile depends on the equipment that is used
for the reflow and the assembly that is being reflowed.
Use the following table from the JEDEC Standard
22A113D and JSTD020D.01 as a guideline:
Electrostatic Discharge (ESD) Sensitive Device
CAUTION: ESD sensitive device. Permanent damage may
occur on devices subjected to highenergy electrostatic
discharges. Proper ESD precautions in handling, packaging
and testing are recommended to avoid performance
degradation or loss of functionality. Device is 2 kV HBM
ESD qualified.
Miscellaneous
Chip Identification
The Evaluation and Development Tools include a method
for verifying the chip version. A BELASIGNA 250 chip will
respond as follows:
Family:
0x01 or 0x02
Version:
0x0B
ROM Version:
0x0206
Support Software
A full suite of comprehensive tools is available to assist
software developers from the initial concept and technology
assessment through to prototyping and product launch.
Simulation, application development and communication
tools as well as an Evaluation and Development Kit (EDK)
facilitate the development of advanced algorithms on
BELASIGNA 250.
Training
To facilitate development on the BELASIGNA 250
platform, training is available upon request. Contact your
account manager for more information.
Company or Product Inquiries
For more information about ON Semiconductor products
Table 11. ORDERING INFORMATION
Part Number
Operating Temperature Range
Package
Shipping
0W633001XTP
85 to 40°C
5 x 5 mm CABGA
(PbFree)
5000 / Tape & Reel
0W888002XTP
85 to 40°C
7 x 7 mm LFBGA
(PbFree)
1500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.