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參數(shù)資料
| 型號： | AS2533 |
| 廠商： | ams |
| 文件頁數(shù)： | 17/26頁 |
| 文件大小： | 0K |
| 描述： | IC TELEPHONE CMOS MULTIFU 28SOIC |
| 標準包裝： | 27 |
| 系列： | * |
Data She et AS25 33-36
austriamicrosystems
Revision 8.10
Page 23 of 25
Conditions for Delivery as Dice on Foil, sawn
Die thickness
380
± 20 m
Back finishing
back grinding, silicon
Frame
Material: Plastic
Size: see figure
Frame Position Tolerance
Center wafer to frame:
± 4mm
Angle deviation wafer to frame:
± 8°
Orientation wafer to frame: Wafer flat to frame side with kerfs
Covering adhesive foil to frame: >5mm
Tape
Type: PVC with acrylic adhesive
Thickness: 70
± 20 m
Sawing conditions
Sawing mode: Saw - through mode
Sawing width: typ. 60
m
Kerf depth in foil: typ. 20
m
XV -dimension deviation: max.25
m
Packing
frame sealed in foil bags filled with nitrogen
Storage time In sealed bags
2 months, Tamb = 25
°C
Mechanical Drawing of Frame (valid for 200 mm and 150 mm wafer)
ams
AG
Technical
content
still
valid
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AS2536 | IC TELEPHONE CMOS MULTIFU 28SOIC |
| AS2540-T | IC TELEPHONE CMOS MULTIFU 28SOIC |
| AS8002-AQFP | IC CURRENT MEASURE SOLAR 16VQFN |
| AS8501-ASOT | IC CURRENT MEASURE SOLAR 16-SOIC |
| AS8510-ASST | IC BATTERY MANAGEMENT 20-SSOP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AS2533/34B/35/36 DB | 制造商:ams 功能描述:Demo Board |
| AS2533/34B/35/36-DB | 制造商:ams 功能描述:AS2533/34B/25/36 Demo Board |
| AS2533_1 | 制造商:AMSCO 制造商全稱:austriamicrosystems AG 功能描述:Multi-Standard CMOS Telephone IC for Basic Telephones |
| AS2533_11 | 制造商:AMSCO 制造商全稱:austriamicrosystems AG 功能描述:Multi-Standard CMOS Telephone IC for Basic Telephones |
| AS2533F | 制造商:AMSCO 制造商全稱:austriamicrosystems AG 功能描述:Multi-Standard CMOS Telephone IC for Basic Telephones |
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