參數(shù)資料
型號： AD9245BCP-80
廠商： ANALOG DEVICES INC
元件分類： ADC
英文描述： 14-Bit, 80 MSPS, 3 V A/D Converter
中文描述： 1-CH 14-BIT FLASH METHOD ADC, PARALLEL ACCESS, QCC32
封裝： EXPOSED PAD, MO-220-VHHD-2, LFCSP-32
文件頁數(shù)： 7/28頁
文件大?。?/td> 1510K
代理商： AD9245BCP-80
AD9245
ABSOLUTE MAXIMUM RATINGS
Table 5. AD9245 Absolute Maximum Ratings
Parameter
With Respect to
ELECTRICAL
AVDD
AGND
DRVDD
DGND
AGND
DGND
AVDD
DRVDD
D0–D13
DGND
CLK, MODE
AGND
VIN+, VIN–
AGND
VREF
AGND
SENSE
AGND
REFT, REFB
AGND
PDWN
AGND
ENVIRONMENTAL
Storage Temperature
Operating Temperature Range
Lead Temperature Range
(Soldering 10 sec)
Junction Temperature
Min
–0.3
–0.3
–0.3
–3.9
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–65
–40
Max
+3.9
+3.9
+0.3
+3.9
DRVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
+125
+85
300
150
Unit
V
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions on a 4-layer board
in still air, in accordance with EIA/JESD51-1.
Table 6. Thermal Resistance
Package Type
CP-32
Airflow increases heat dissipation, effectively reducing θ
JA
.
Also, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduces the θ
JA
. It is recommended that the exposed paddle be
soldered to the ground plane for the LFCSP package. There is an
increased reliability of the solder joints, and maximum thermal
capability of the package is achieved with the exposed paddle
soldered to the customer board.
θ
JA
32.5
θ
JC
32.71
Unit
°C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. B | Page 7 of 28
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