參數(shù)資料
型號: AD9245BCP-80
廠商: ANALOG DEVICES INC
元件分類: ADC
英文描述: 14-Bit, 80 MSPS, 3 V A/D Converter
中文描述: 1-CH 14-BIT FLASH METHOD ADC, PARALLEL ACCESS, QCC32
封裝: EXPOSED PAD, MO-220-VHHD-2, LFCSP-32
文件頁數(shù): 25/28頁
文件大?。?/td> 1510K
代理商: AD9245BCP-80
AD9245
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
BOTTOM
VIEW
0.50
0.40
0.30
3.50 REF
0.50
BSC
3.25
3.10 SQ
2.95
0.60 MAX
0.60 MAX
0.25MIN
TOP
PIN 1
INDICATOR
PIN 1
INDICATOR
5.00
BSC SQ
4.75
BSC SQ
Figure 46. 32-Lead Frame Chip Scale Package [LFCSP]
(CP-32-1)
Dimensions shown in millimeters
ORDERING GUIDE
AD9245 Products
AD9245BCP-80
1
AD9245BCPRL7–80
1
AD9245BCPZ-80
1,
2
AD9245BCPZRL7-80
1,
2
AD9245BCP-80EB
1
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Evaluation Board
Package Outline
CP-32-1
CP-32-1
CP-32-1
CP-32-1
1
It is recommended that the exposed paddle be soldered to the ground plane for the LFCSP package. There is an increased reliability of the solder joints, and the maxi-
mum thermal capability of the package is achieved with the exposed paddle soldered to the customer board.
2
Z = Lead Free.
Rev. B | Page 25 of 28
相關(guān)PDF資料
PDF描述
AD9245BCPRL7-80 14-Bit, 80 MSPS, 3 V A/D Converter
AD9245BCPZ-80 14-Bit, 80 MSPS, 3 V A/D Converter
AD9245BCPZRL7-80 14-Bit, 80 MSPS, 3 V A/D Converter
AD9248 14-Bit, 20/40/65 MSPS Dual A/ D Converter
AD9248-20PCB 14-Bit, 20/40/65 MSPS Dual A/ D Converter
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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