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參數(shù)資料
| 型號： | AD8150ASTZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 21/44頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC CROSSPOINT SWIT 33X17 184LQFP |
| 標(biāo)準包裝： | 1 |
| 系列： | XStream™ |
| 功能： | 交叉點開關(guān) |
| 電路： | 1 x 33:17 |
| 電壓電源： | 雙電源 |
| 電壓 - 電源，單路/雙路(±)： | ±3 V ~ 5.25 V |
| 工作溫度： | 0°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 184-LQFP |
| 供應(yīng)商設(shè)備封裝： | 184-LQFP（20x20） |
| 包裝： | 管件 |
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AD8150
Rev. A | Page 28 of 44
HEAT SINKING
Depending on several factors in its operation, the AD8150 can
dissipate 2 W or more. The part is designed to operate without
the need for an explicit external heat sink. However, the package
design offers enhanced heat removal via some of the package
pins to the PC board traces.
The VEE pins on the input sides of the package (Pins 1 to 46 and
Pins 93 to 138) have finger extensions inside the package that
connect to the paddle on which the IC chip is mounted. These
pins provide a lower thermal resistance from the IC to the VEE
pins than pins that just have a bond wire. As a result, these pins
can be used to enhance the heat removal process from the IC to
the circuit board and ultimately to the ambient.
The VEE pins described above should be connected to a large
area of circuit board trace material to take the most advantage
of their lower thermal resistance. If there is a large area available
on an inner layer that is at VEE potential, then vias can be
provided from the package pin traces to this layer. There should
be no thermal-relief pattern when connecting the vias to the
inner layers for these VEE pins. Additional vias in parallel and
close to the pin leads can provide an even lower thermal
resistive path. If possible to use, 2 oz. copper foil will provide
better heat removal than 1 oz.
The AD8150 package has a specified thermal impedance, θJA, of
30°C/W. This is the worst case still-air value that can be
expected when the circuit board does not significantly enhance
the heat removal from the package. By using the concept
described above or by using forced-air circulation, the thermal
impedance can be lowered.
For an extreme worst case analysis, the junction rise above the
ambient can be calculated assuming 2 W of power dissipation
and θJA of 30°C/W to yield a 60°C rise above the ambient. There
are many techniques described above that can mitigate this
situation. Most actual circuits will not result in such a high rise
of the junction temperature above the ambient.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD8150ASTZ | 制造商:Analog Devices 功能描述:IC DIGITAL CROSSPOINT SWITCH |
| AD8150-EVAL | 制造商:Analog Devices 功能描述:EVAL KIT FOR 33 17, 1.5 GBPS DGTL CROSSPOINT SWIT - Bulk |
| AD8151 | 制造商:AD 制造商全稱:Analog Devices 功能描述:33 x 17, 3.2 Gb/s Digital Crosspoint Switch |
| AD8151AST | 制造商:AD 制造商全稱:Analog Devices 功能描述:33 x 17, 3.2 Gb/s Digital Crosspoint Switch |
| AD8151ASTZ | 功能描述:IC CROSSPOINT SWIT 33X17 184LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:XStream™ 其它有關(guān)文件:STG4159 View All Specifications 標(biāo)準包裝:5,000 系列:- 功能:開關(guān) 電路:1 x SPDT 導(dǎo)通狀態(tài)電阻:300 毫歐 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±1.65 V ~ 4.8 V 電流 - 電源:50nA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:7-WFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:7-覆晶 包裝:帶卷 (TR) |
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