參數(shù)資料
型號： AD7610BSTZ-RL
廠商： Analog Devices Inc
文件頁數(shù)： 2/32頁
文件大?。?/td> 0K
描述： IC ADC 16BIT 250KSPS 48-LQFP
標(biāo)準(zhǔn)包裝： 2,000
系列： PulSAR®
位數(shù)： 16
采樣率（每秒）： 250k
數(shù)據(jù)接口： 串行，并聯(lián)
轉(zhuǎn)換器數(shù)目： 1
功率耗散（最大）： 110mW
電壓電源： 模擬和數(shù)字
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 48-LQFP
供應(yīng)商設(shè)備封裝： 48-LQFP（7x7）
包裝： 帶卷 (TR)
輸入數(shù)目和類型： 1 個(gè)差分，單極；1 個(gè)差分，雙極
AD7610
Data Sheet
Rev. A | Page 10 of 32
Pin No.
Mnemonic
Type1
Description
27
D14 or
DI/O
In parallel mode, this output is used as Bit 14 of the parallel port data output bus.
SCCLK
Serial Configuration Clock. In serial software configuration mode (SER/PAR = high, HW/SW = low) this input is
used to clock in the data on SCIN. The active edge where the data SCIN is updated depends on the logic state
of the INVSCLK pin. See the
28
D15 or
DI/O
In parallel mode, this output is used as Bit 15 of the parallel port data output bus.
SCCS
Serial Configuration Chip Select. In serial software configuration mode (SER/PAR = high, HW/SW = low) this
input enables the serial configuration port. See the
29
BUSY
DO
Busy Output. Transitions high when a conversion is started, and remains high until the conversion
is complete and the data is latched into the on-chip shift register. The falling edge of BUSY can be
used as a data ready clock signal. Note that in master read after convert mode (SER/PAR = high, EXT/INT = low,
RDC = low) the busy time changes according to
30
TEN
Input Range Select. Used in conjunction with BIPOLAR per the following:
Input Range
BIPOLAR
TEN
0 V to 5 V
Low
0 V to 10 V
Low
High
±5 V
High
Low
±10 V
High
31
RD
DI
Read Data. When CS and RD are both low, the interface parallel or serial output bus is enabled.
32
CS
DI
Chip Select. When CS and RD are both low, the interface parallel or serial output bus is enabled. CS is also
used to gate the external clock in slave serial mode (not used for serial programmable port).
33
RESET
DI
Reset Input. When high, reset the AD7610. Current conversion, if any, is aborted. The falling edge of RESET
resets the data outputs to all zero’s (with OB/2C = high) and clears the configuration register. See the
Interface section. If not used, this pin can be tied to OGND.
34
PD
Power-Down Input. When PD = high, power down the ADC. Power consumption is reduced and conversions
are inhibited after the current one is completed. The digital interface remains active during power down.
35
CNVST
DI
Conversion Start. A falling edge on CNVST puts the internal sample-and-hold into the hold state and initiates
a conversion.
36
BIPOLAR
Input Range Select. See description for Pin 30.
37
REF
AI/O
Reference Input/Output. When PDREF/PDBUF = low, the internal reference and buffer are enabled, producing 5 V
on this pin. When PDREF/PDBUF = high, the internal reference and buffer are disabled, allowing an externally
supplied voltage reference up to AVDD volts. Decoupling with at least a 22 μF is required with or without the
internal reference and buffer. See the
38
REFGND
AI
Reference Input Analog Ground. Connected to analog ground plane.
39
IN
AI
Analog Input Ground Sense. Should be connected to the analog ground plane or to a remote sense ground.
40
VCC
P
High Voltage Positive Supply. Normally +7 V to +15 V.
41
VEE
P
High Voltage Negative Supply. Normally 0 V to 15 V (0 V in unipolar ranges).
43
IN+
AI
Analog Input. Referenced to IN.
45
TEMP
AO
Temperature Sensor Analog Output. Enabled when the internal reference is turned on (PDREF = PDBUF =
low). See the
46
REFBUFIN
AI
Reference Buffer Input. When using an external reference with the internal reference buffer (PDBUF = low,
PDREF = high), applying 2.5 V on this pin produces 5 V on the REF pin. See the
47
PDREF
DI
Internal Reference Power-Down Input.
When low, the internal reference is enabled.
When high, the internal reference is powered down, and an external reference must be used.
48
PDBUF
DI
Internal Reference Buffer Power-Down Input.
When low, the buffer is enabled (must be low when using internal reference).
When high, the buffer is powered-down.
49
EPAD3
NC
Exposed Pad. The exposed pad is not connected internally. It is recommended that the pad be soldered
to VEE.
1
AI = analog input; AI/O = bidirectional analog; AO = analog output; DI = digital input; DI/O = bidirectional digital; DO = digital output; P = power.
2 In serial configuration mode (SER/PAR = high, HW/SW = low), this input is programmed with the serial configuration register and this pin is a don’t care. See the
3
LFCSP_VQ package only.
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