參數(shù)資料
型號: 89HPES8T5AZBBCI
廠商: INTEGRATED DEVICE TECHNOLOGY INC
元件分類: 總線控制器
英文描述: PCI BUS CONTROLLER, PBGA196
封裝: 15 X 15 MM, 1 MM PITCH, CABGA-196
文件頁數(shù): 7/29頁
文件大?。?/td> 622K
代理商: 89HPES8T5AZBBCI
15 of 29
May 7, 2009
IDT 89HPES8T5A Data Sheet
Power Consumption
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 13.
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
All power measurements assume that the part is mounted on a 10 layer printed circuit board with 0 LFM airflow.
Thermal Considerations
This section describes thermal considerations for the PES8T5A (15mm2 BCG196 package). The data in Table 16 below contains information that
is relevant to the thermal performance of the PES8T5A switch.
Number of
Connected
Lanes
Core Supply
PCIe Digital
Supply
PCIe Analog
Supply
PCIe Termin-
ation Supply
I/O Supply
Total
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
1.5V
Max
1.575V
Typ
3.3V
Max
3.465V
Typ
Power
Max
Power
4/1/1/1/1
mA
308
495
327
440
130
187
161
222
3
3.3
Watts
0.31
0.54
0.33
0.48
0.13
0.21
0.24
0.35
0.01
1.02
1.60
Table 15 PES8T5A Power Consumption
Symbol
Parameter
Value
Units
Conditions
TJ(max)
Junction Temperature
125
oCMaximum
TA(max)
Ambient Temperature
70
oC
Maximum for commercial-rated products
TA(max)
Ambient Temperature
85
oC
Maximum for industrial-rated products
θJA(effective)
Effective Thermal Resistance, Junction-to-Ambient
33.3
oC/W
Zero air flow
29
oC/W
1 m/S air flow
26.6
oC/W
2 m/S air flow
θJB
Thermal Resistance, Junction-to-Board
18.7
oC/W
θJC
Thermal Resistance, Junction-to-Case
9.8
oC/W
P
Power Dissipation of the Device
1.60
Watts
Maximum
Table 16 Thermal Specifications for PES8T5A, 15x15mm BCG196 Package
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