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參數(shù)資料
| 型號： | 79RC5000 |
| 廠商： | Integrated Device Technology, Inc. |
| 元件分類： | 64位微處理器 |
| 英文描述： | MULTI-ISSUE 64-BIT MICROPROCESSOR |
| 中文描述： | 多發(fā)行64位微處理器 |
| 文件頁數(shù)： | 4/15頁 |
| 文件大?。?/td> | 297K |
| 代理商： | 79RC5000 |
4 of 15
April 10, 2001
79RC5000
The RC5000 contains the following computational units:
!!
""
Integer ALU. The RC5000 implements a full, single-cycle 64-bit ALU
for all integer ALU functions other than multiply and divide. Bypassing is
used to support back-to-back ALU operations at the full pipeline rate,
without requiring stalls for data dependencies.
Integer Multiply/Divide Unit. This unit is separated fromthe primary
ALU, to allow these longer latency operations to run in parallel with other
operations. The pipeline stalls only if an attempt to access the HI or LO
registers is made before the operation completes.
Floating-point ALU. This unit is responsible for all CP1/CP1X ALU
operations other than DIV/SQRT. The unit is pipelined to allow a single-
cycle repeat rate for single-precision operations
Floating-point DIV/SQRT unit. This unit is separated fromthe other
floating-point ALU, so that these long latency operations do not prevent
the issue of other floating point operations.
In addition, the RC5000 implements separate logical units to imple-
ment loads, stores, and branches.
The input clock operates in a frequency range of 33MHz to 100MHz.
The pipeline frequency for the RC5000 is 2 to 8 times the input clock (up
to the maximumfor the speed grade of CPU).
##
The RC5000 utilizes special packaging techniques, to improve the
thermal properties of high-speed processors. The RC5000 is packaged
using cavity down packaging in a 223-pin PGA package with integral
thermal slug, and a 272-pin BGA package. These packages effectively
dissipate the power of the CPU, increasing device reliability.
The RC5000 utilizes an all-alumnumpackage with the die attached
to a normal copper lead frame mounted to the alumnumcasing. Due to
the heat-spreading effect of the alumnum the package allows for an
efficient thermal transfer between the die and the case. The alumnum
offers less internal resistance fromone end of the package to the other,
reducing the temperature gradient across the package and therefore
presenting a greater area for convection and conduction to the PCB for
a given temperature. Even nomnal amounts of airflow will dramatically
reduce the junction temperature of the die, resulting in cooler operation.
The RC5000 is guaranteed in a case temperature range of 0
°
to
+85
°
C. The type of package, speed (power) of the device, and airflow
conditions affect the equivalent ambient temperature conditions that will
meet this specification.
The equivalent allowable ambient temperature, T
A
, can be calculated
using the thermal resistance fromcase to ambient (
CA
) of the given
package.
The following equation relates ambient and case temperatures:
T
A
= T
C
- P *
CA
where P is the maximumpower consumption at hot temperature,
calculated by using the maximumI
CC
specification for the device.
Typical values for
CA
at various airflows are shown in Table 1.
Note:
The RC5000 implements advanced power manage-
ment to substantially reduce the average power dissipation of
the device. This operation is described in the
IDT79RV5000
RISC Microprocessor Reference Manual.
$
Per the RC5000 Documentation errata, Revision 1.0, dated February
1999 and per the RC5000 Device errata, dated February 1999, mode
bits 20, 33 and 37 must be set to 1.
%% &&
January 1996:
Corrected pin list for Clock/Control, Initialization, and
Secondary Cache interfaces in Pin Description section. Changed pins
AA19 and AA21 fromVcc to Vss in Advance Pin-Out section.
''
March 1997:
Upgraded data sheet status from
“
Prelimnary
”
to Final.
Added section on thermal considerations. Added section on absolute
maximumratings.
June 1997:
Revised Power Consumption and SystemInterface
Parameters.
September 1997:
Added user notation on Boot Mode Bits 20 and 33
for 200 MHz frequency.
June 1998:
Added 250 MHz. Changed namng conventions.
June 1999:
Added 267 MHz and 300 MHz.
October 28, 1999:
Added industrial temperature data and revised
package designation code in the Ordering Information section.
March 23, 2000:
Expanded the data presentation in the System
Interface Parameters table and revised the values in this table.
April 10, 2001:
In the Data Output and Data Output Hold categories
of the SystemInterface Parameters table, changed values in the Mn
column for all speeds from1.5 and 1.0 to 0.
CA
Airflow (ft/min)
0
200
400
600
800
1000
PGA
16
7
5
3
2.5
2
BGA
14
6
4
3
2.5
2
Table 2 Thermal Resistance (yCA) at Various Airflows
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