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STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
5962-90899
REVISION LEVEL
C
SHEET
3
DSCC FORM 2234
APR 97
1.2.5 Lead finish.
The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix
A for device class M.
1.3 Absolute maximum ratings. 1/
Endurance:
Device types 01-04, 09 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10,000 cycles/byte, minimum
Device types 05-08 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1,000 cycles/byte, minimum
Device types 10-13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100,000 cycles/byte, minimum
Supply voltage range (V
) 2/ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0 V dc to +7.0 V dc
CC
Storage temperature range (T
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65
(
C to +150
(
C
stg
Maximum power dissipation (PD
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . +300
(
C
Junction temperature (TJ
(
C
Thermal resistance, junction-to-case (
) (case outline X, Y) . . . . . . See MIL-STD-1835
JC
Thermal resistance, junction-to-case (
) (case outlines T, Z) . . . . . . 13
(
C/W
JC
Thermal resistance, junction-to-case (
) (case outline U) . . . . . . . . . 27
(
C/W
JC
Voltage on any pin with respect to ground 2/ . . . . . . . . . . . . . . . . . . . . . -2.0 V dc to +7.0 V dc
Voltage on pin A9
V
supply voltage with respect to ground 4/ . . . . . . . . . . . . . . . . . . . . -2.0 V dc to +14.0 V dc
PP
V
supply voltage with respect to ground 2/ . . . . . . . . . . . . . . . . . . . . -2.0 V dc to +7.0 V dc
CC
Output short circuit current 5/ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
Data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 years minimum
1.4 Recommended operating conditions. 6/
Supply voltage range (V
Operating temperature range (T
Low level input voltage range (VIL
High level input voltage range (V
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +2.0 V dc to V
IH
High level input voltage range, CMOS (V
) . . . . . . . . . . . . . . . . . . . . . . V
IH
Chip clear (VP
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc
CC
) . . . . . . . . . . . . . . . . . . . . . . . . . . . -55
(
C to +125
(
C
case
+0.5 V dc
CC
CC
-0.5 V dc to V
CC
+0.5 V dc
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . . . . . . . . 100 percent
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Minimum dc voltage on input or VO
periods of up to 20 ns. Maximum dc voltage on output and VO
may overshoot to V
+2.0 V for periods up to 20 ns.
CC
3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
4/ Minimum dc input voltage on A9
may overshoot to +14.0 V for periods less than 20 ns.
PP
5/ No more than one output shorted at a time. Duration of short circuit should not be greater than 1 second.
6/ All voltages are referenced to V
(ground).
SS
to -2.0 V for
SS
+0.5 V. During voltage transitions outputs
CC