- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄384068 > μPD78P0208 (NEC Corp.) 8 Bit Single Chip Microcontrollers(8位單片微控制器) PDF資料下載
參數(shù)資料
| 型號(hào)： | μPD78P0208 |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機(jī)微控制器（8位單片微控制器） |
| 文件頁(yè)數(shù)： | 64/72頁(yè) |
| 文件大?。?/td> | 424K |
| 代理商： | ΜPD78P0208 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)當(dāng)前第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)
64
m
PD78P0208
12. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
m
PD78P0208.
For details of the recommended soldering conditions, refer to our document Semiconductor Device Mounting
Technology Manual(C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 12-1 Soldering Conditions for Surface-Mount Devices
m
PD78P0208GF-3BA: 100-pin plastic QFP (14
￥
20 mm)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
Recommended
conditions
Soldering process
Soldering conditions
Peak package's surface temperature: 235 °C
Reflow time: 30 seconds or less (210 °C or more)
Maximum allowable number of reflow processes: 2
Peak package's surface temperature: 215 °C
Reflow time: 40 seconds or less (200 °C or more)
Maximum allowable number of reflow processes: 2
Solder temperature: 260 °C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
: 120 °C max.
(measured on the package surface)
Terminal temperature: 300 °C or less
Heat time: 3 seconds or less (for one side of a device)
IR35-00-2
VP15-00-2
WS60-00-1
–
Infrared ray reflow
VPS
Wave soldering
Partial heating method
#
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| μPD78P0308Y | 8 Bit Single Chip Microcontrollers |
| μPD9210FGC-7EA | USB Host Controller(USB主控制器) |
| μPD98402A | Ultraframer DS3/E3/DS2/E2/DS1/E1/DS0 |
| μPD98402 | Ultraframer DS3/E3/DS2/E2/DS1/E1/DS0 |
| μPD98404 | High-performance ATM controller(高性能異步傳輸模式控制器) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PD7935 | 制造商:MITSUBISHI 制造商全稱(chēng):Mitsubishi Electric Semiconductor 功能描述:FOR OPTICAL COMMUNICATION |
| PD7937 | 制造商:MITSUBISHI 制造商全稱(chēng):Mitsubishi Electric Semiconductor 功能描述:InGaAs PIN PHOTO DIODES |
| PD793D26 | 制造商:MITSUBISHI 制造商全稱(chēng):Mitsubishi Electric Semiconductor 功能描述:InGaAs PIN PHOTO DIODES |
| PD793D7 | 制造商:MITSUBISHI 制造商全稱(chēng):Mitsubishi Electric Semiconductor 功能描述:InGaAs PIN PHOTO DIODES |
| PD79920-0M | 制造商:Citizen Systems America Corporation 功能描述:Mobile Printer - PD24 USB Cable |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。