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參數(shù)資料
| 型號： | μPD78P0208 |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機(jī)微控制器（8位單片微控制器） |
| 文件頁數(shù)： | 10/72頁 |
| 文件大?。?/td> | 424K |
| 代理商： | ΜPD78P0208 |
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10
m
PD78P0208
CONTENTS
1.
DIFFERENCES BETWEEN THE
m
PD78P0208 AND MASK ROM PRODUCTS....................
11
2.
LIST OF PIN FUNCTIONS ........................................................................................................
2.1
PINS FOR NORMAL OPERATING MODE ....................................................................................
2.2
PINS FOR PROM PROGRAMMING MODE ..................................................................................
2.3
I/O CIRCUITS FOR PINS AND TREATMENT OF UNUSED PINS ..............................................
12
12
15
16
3.
INTERNAL MEMORY SWITCHING (IMS) REGISTER ............................................................
20
4.
INTERNAL EXPANDED RAM SWITCHING (IXS) REGISTER................................................
21
5.
PROM PROGRAMMING............................................................................................................
5.1
OPERATION MODE........................................................................................................................
5.2
PROM WRITE SEQUENCE ............................................................................................................
5.3
PROM READ SEQUENCE .............................................................................................................
22
22
24
28
6.
ERASURE CHARACTERISTICS (
m
PD78P0208KL-T ONLY) .................................................
29
7.
PROTECTIVE FILM COVERING THE ERASURE WINDOW (
m
PD78P0208KL-T ONLY) .....
29
8.
SCREENING ONE-TIME PROM PRODUCTS ..........................................................................
29
9.
ELECTRICAL SPECIFICATIONS .............................................................................................
30
10. CHARACTERISTIC CURVE (REFERENCE VALUE) ..............................................................
57
11. PACKAGE DRAWINGS.............................................................................................................
62
12. RECOMMENDED SOLDERING CONDITIONS ........................................................................
64
APPENDIX A DEVELOPMENT TOOLS .........................................................................................
65
APPENDIX B RELATED DOCUMENTS.........................................................................................
69
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