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參數(shù)資料
| 型號： | μPD789800 |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機微控制器（8位單片微控制器） |
| 文件頁數(shù)： | 42/48頁 |
| 文件大小： | 266K |
| 代理商： | ΜPD789800 |
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42
μ
PD789800
12. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD789800 should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual
(C10535E).
For soldering methods and conditions other than those recommended below, contact our sales representatives.
Table 12-1. Surface Mounting Type Soldering Conditions
μ
PD789800GB-
×××
-3BS-MTX: 44-pin plastic QFP (10
×
10 mm)
Soldering method
Soldering conditions
Symbol
Infrared reflow
Package peak temperature: 235°C
Duration: 30 sec. max. (at 210°C or above)
Maximum allowable number of reflow processes: 3
IR35-00-3
VPS
Package peak temperature: 215°C
Duration: 40 sec. max. (at 200°C or above)
Maximum allowable number of reflow processes: 3
VP15-00-3
Wave soldering
Solder bath temperature: 260°C max.
Duration: 10 sec. max.
Number of times: Once
Preliminary heat temperature: 120°C max. (Package surface temperature)
WS60-00-1
Partial heating
method
Terminal temperature: 300°C max. Duration: 3 sec. max. (per device side)
-
Caution
Use of more than one soldering method should be avoided (except for partial heating method).
Table 12-2. Insertion Type Soldering Conditions
μ
PD789800CU-
×××
:
42-pin plastic shrink DIP (600 mil)
Soldering method
Soldering conditions
Wave soldering (terminal only)
Solder bath temperature: 260°C max., Duration: 10 sec. max.
Partial heating method
Terminal temperature: 300°C max., Duration: 3 sec. max. (for each pin)
Caution
Apply wave soldering to terminals only. See to it that the jet solder does not contact with the
chip directly.
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