參數(shù)資料
型號： XRM48L950PGET
廠商： Texas Instruments
文件頁數(shù)： 133/176頁
文件大?。?/td> 0K
描述： MCU 16/32Bit FLASH 3MB 144LQFP
標(biāo)準(zhǔn)包裝： 1
系列： Hercules™ ARM® RM4x
應(yīng)用： 工業(yè)安全，醫(yī)療
核心處理器： ARM? Cortex? - R4F
程序存儲器類型： 閃存（3MB）
控制器系列： RM4
RAM 容量： 256K x 8
接口： CAN，以太網(wǎng)，I²C，LIN，MibSPI，SCI，SPI，USB
輸入/輸出數(shù)： 64
電源電壓： 1.14 V ~ 3.6 V
工作溫度： -40°C ~ 105°C
安裝類型： 表面貼裝
封裝/外殼： 144-LQFP
包裝： 托盤
供應(yīng)商設(shè)備封裝： 144-LQFP（20x20）
其它名稱： 296-29389
SPNS174A – APRIL 2012 – REVISED SEPTEMBER 2013
1
RM48Lx50 16- and 32-Bit RISC Flash
4.9
Device Memory Map
................................ 74
Microcontroller
.......................................... 1
4.10
Flash Memory
...................................... 81
1.1
Features
............................................. 1
4.11
Tightly-Coupled RAM Interface Module
............ 84
1.2
Applications
.......................................... 2
4.12
Parity Protection for peripheral RAMs
.............. 84
1.3
Description
........................................... 3
4.13
On-Chip SRAM Initialization and Testing
........... 86
1.4
Functional Block Diagram
........................... 5
4.14
External Memory Interface (EMIF)
................. 88
Revision History
.............................................. 7
4.15
Vectored Interrupt Manager
........................ 96
2
Device Package and Terminal Functions
.......... 9
4.16
DMA Controller
..................................... 99
2.1
PGE QFP Package Pinout (144-Pin)
................ 9
4.17
Real Time Interrupt Module
....................... 102
2.2
ZWT BGA Package Ball-Map (337 Ball Grid Array)
4.18
Error Signaling Module
............................ 104
2.3
Terminal Functions
................................. 11
4.19
Reset / Abort / Error Sources
..................... 108
3
Device Operating Conditions
....................... 46
4.20
Digital Windowed Watchdog
...................... 110
3.1
Absolute Maximum Ratings Over Operating Free-
4.21
Debug Subsystem
................................. 111
Air Temperature Range,
............................ 46
5
Peripheral Information and Electrical
3.2
Device Recommended Operating Conditions
...... 46
Specifications
......................................... 122
3.3
Switching Characteristics over Recommended
5.1
Peripheral Legend
................................ 122
Operating Conditions for Clock Domains
.......... 47
5.2
Multi-Buffered 12bit Analog-to-Digital Converter
.. 122
3.4
Wait States Required
............................... 47
5.3
General-Purpose Input/Output
.................... 133
3.5
Power Consumption Over Recommended
5.4
Enhanced High-End Timer (N2HET)
.............. 134
Operating Conditions
............................... 48
5.5
Controller Area Network (DCAN)
.................. 139
3.6
Input/Output Electrical Characteristics Over
Recommended Operating Conditions
.............. 49
5.6
Local Interconnect Network Interface (LIN)
....... 140
3.7
Output Buffer Drive Strengths
...................... 49
5.7
Serial Communication Interface (SCI)
............ 141
3.8
Input Timings
....................................... 50
5.8
Inter-Integrated Circuit (I2C)
...................... 142
3.9
Output Timings
..................................... 51
5.9
Multi-Buffered / Standard Serial Peripheral Interface
..................................................... 145
3.10
Low-EMI Output Buffers
............................ 53
5.10
Ethernet Media Access Controller
................ 157
4
System Information and Electrical Specifications
............................................................. 55
5.11
Universal Serial Bus Controller
................... 161
4.1
Device Power Domains
............................ 55
6
Device and Documentation Support
............. 163
4.2
Voltage Monitor Characteristics
.................... 56
6.1
Device Nomenclature
............................. 163
4.3
Power Sequencing and Power On Reset
.......... 57
6.2
Device Identification
............................... 164
4.4
Warm Reset (nRST)
................................ 59
6.3
Module Certifications
.............................. 166
4.5
ARM Cortex-R4F CPU Information
............. 60
7
Mechanical Data
...................................... 171
4.6
Clocks
.............................................. 63
7.1
Thermal Data
...................................... 171
4.7
Clock Monitoring
.................................... 71
7.2
Packaging Information
............................ 171
4.8
Glitch Filters
........................................ 73
6
Contents
Copyright 2012–2013, Texas Instruments Incorporated
Product Folder Links: RM48L950 RM48L750 RM48L550
相關(guān)PDF資料
PDF描述
FF02S27SV1 CONN FFC/FPC 0.3MM 27POS R/A SMD
395-026-524-202 CARD EDGE 26POS DL .100X.200 BLK
395-026-524-201 CARD EDGE 26POS DL .100X.200 BLK
395-026-523-804 CARD EDGE 26POS DL .100X.200 BLK
395-026-523-802 CARD EDGE 26POS DL .100X.200 BLK
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XRM48L950ZWTT 功能描述:ARM微控制器 - MCU HERCULES MCU RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
XRM48L952PGET 功能描述:ARM微控制器 - MCU 16/32B RISC Fl. MCU RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
XRM48L952ZWTT 功能描述:ARM微控制器 - MCU 16/32B RISC Fl. MCU RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
XRMQ108D00 制造商:TE Connectivity 功能描述:
XRMQ208K005+01 制造商:TE Connectivity 功能描述:
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*