參數(shù)資料
型號: XP1009
廠商: Mimix Broadband, Inc.
英文描述: 17.0-21.0 GHz GaAs MMIC Power Amplifier
中文描述: 17.0-21.0 GHz的砷化鎵單片功率放大器
文件頁數(shù): 4/6頁
文件大?。?/td> 154K
代理商: XP1009
Page 4 of 6
17.0-21.0 GHz GaAs MMIC
Power Amplifier
Mechanical Drawing
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.111 mg.
Bias Arrangement
Bond Pad #1 (RF In)
Bond Pad #2 (RF Out)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vg2)
Bond Pad #5 (Vd1)
Bond Pad #6 (Vg1)
Bypass Capacitors
- See App Note [2]
1
1.280
(0.050)
0.736
(0.029)
0.0
0.0
0.736
(0.029)
2.185
(0.086)
3.920
(0.154)
1.585
(0.062)
1.185
(0.047)
0.785
(0.031)
2
6
5
4
3
RF Out
RF In
Vg1
Vd1
1
2
6
5
4
3
10
Vd2
Vg2
10
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
May 2006 - Rev 10-May-06
P1009
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