參數(shù)資料
型號： W25X32-VSSI-Z
廠商： WINBOND ELECTRONICS CORP
元件分類： PROM
英文描述： 32M X 1 FLASH 2.7V PROM, PDSO8
封裝： 0.208 INCH, ROHS COMPLIANT, SOIC-8
文件頁數(shù)： 23/47頁
文件大?。?/td> 1317K
代理商： W25X32-VSSI-Z
W25X16, W25X32, W25X64
Publication Release Date: June 28, 2006
- 3 -
Preliminary - Revision B
11.2.4
Write Enable (06h)........................................................................................................18
11.2.5
Read Status Register (05h) ..........................................................................................19
11.2.6
Write Status Register (01h) ..........................................................................................20
11.2.7
Read Data (03h) ...........................................................................................................21
11.2.8
Fast Read (0Bh) ...........................................................................................................22
11.2.9
Fast Read Dual Output (3Bh) .......................................................................................23
11.2.10
Page Program (02h) ...................................................................................................24
11.2.11
Sector Erase (20h) .....................................................................................................25
11.2.12
Block Erase (D8h) ......................................................................................................26
11.2.13
Chip Erase (C7h) ........................................................................................................27
11.2.14
Power-down (B9h) ......................................................................................................28
11.2.15
Release Power-down / Device ID (ABh) .....................................................................29
11.2.16
Read Manufacturer / Device ID (90h) .........................................................................31
11.2.17
JEDEC ID (9Fh)..........................................................................................................32
12.
ELECTRICAL CHARACTERISTICS (PRELIMINARY) (4) ....................................................... 33
12.1
Absolute Maximum Ratings (1) .................................................................................... 33
12.2
Operating Ranges......................................................................................................... 33
12.3
Endurance and Data Retention .................................................................................... 34
12.4
Power-up Timing and Write Inhibit Threshold .............................................................. 34
12.5
DC Electrical Characteristics ........................................................................................ 35
12.6
AC Measurement Conditions........................................................................................ 36
12.7
AC Electrical Characteristics ........................................................................................ 37
12.8
AC Electrical Characteristics (cont’d) ........................................................................... 38
12.9
Serial Output Timing ..................................................................................................... 39
12.10
Input Timing................................................................................................................. 39
12.11
Hold Timing ................................................................................................................. 39
13.
PACKAGE SPECIFICATION .................................................................................................... 40
13.1
8-Pin SOIC 208-mil (Package Code SS)...................................................................... 40
13.2
8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 41
13.3
8-contact 6x5 WSON .................................................................................................... 42
13.4
8-contact 6x5 WSON Cont’d. ....................................................................................... 43
13.5
16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 44
14.
ORDERING INFORMATION
(1)................................................................................................. 45
15.
REVISION HISTORY ................................................................................................................46
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