參數(shù)資料
型號(hào): VSC6250
廠商: VITESSE SEMICONDUCTOR CORP
元件分類: 標(biāo)準(zhǔn)邏輯
英文描述: 1Gb/s 16-Channel Drive-Side Deskew IC
中文描述: SPECIALTY LOGIC CIRCUIT, PQFP128
封裝: PLASTIC, QFP-128
文件頁(yè)數(shù): 16/18頁(yè)
文件大?。?/td> 240K
代理商: VSC6250
VITESSE
Data Sheet
VSC6250
1Gb/s 16-Channel
Drive-Side Deskew IC
Page 16
VITESSE
SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 805/388-3700 FAX: 805/987-5896
G52197-0, Rev. 4.0
8/19/00
Package Thermal Characteristics
The VSC6250 is packaged in an 128-pin, 14x20mm thermally-enhanced PQFP with an internal heat
spreader. These packages use industry-standard EIAJ footprints, which have been enhanced to improve thermal
dissipation. The construction of the packages are as shown in Figure 9. The VSC6250 is designed to operate
with a case temperature up to 90
o
C. The user must guarantee that the temperature specification is not violated.
Figure 9: Package Cross Section
Table 7: Thermal Resistance
Symbol
Description
Value
Units
θ
JC
θ
CA-0
θ
CA-100
θ
CA-200
θ
CA-400
θ
CA-600
θ
CA-800
Thermal resistance from junction-to-case
Thermal resistance from case-to-ambient, still air
Thermal resistance from case-to-ambient, 100 LFPM air
Thermal resistance from case-to-ambient, 200 LFPM air
Thermal resistance from case-to-ambient, 400 LFPM air
Thermal resistance from case-to-ambient, 600 LFPM air
Thermal resistance from case-to-ambient, 800 LFPM air
6.6
23
21
19.9
18
17.3
16.6
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
Lead
Die
Plastic Molding Compound
Insulator
Wire Bond
Exposed Heat Slug
Thermal Epoxy
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