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參數(shù)資料
| 型號： | UPD784031GK-BE9 |
| 廠商： | NEC Corp. |
| 英文描述： | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| 中文描述： | 16/8-BIT單片機(jī) |
| 文件頁數(shù)： | 81/90頁 |
| 文件大?。?/td> | 377K |
| 代理商： | UPD784031GK-BE9 |
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μ
PD784031
81
Table 16-1. Soldering Conditions for Surface-Mount Devices (2/2)
(3)
μ
PD784031GK-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm)
Note
Maximum number of days during which the product can be stored at a temperature of 25
°
C and a relative
humidity of 65 % or less after dry-pack package is opened.
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
Soldering process
Infrared ray reflow
VPS
Partial heating method
Symbol
IR35-107-2
VP15-107-2
-
Soldering conditions
Peak package’s surface temperature: 235
°
C
Reflow time: 30 seconds or less (210
°
C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 7 days
Note
(10 hours of pre-baking is required at 125
°
C
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
Peak package’s surface temperature: 215
°
C
Reflow time: 40 seconds or less (200
°
C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 7 days
Note
(10 hours of pre-baking is required at 125
°
C
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
Terminal temperature: 300
°
C or less
Heat time: 3 seconds or less (for one side of a device)
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