- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄384046 > UPD780033AYGK (NEC Corp.) 8-BIT SINGLE-CHIP MICROCONTROLLERS PDF資料下載
參數(shù)資料
| 型號(hào)： | UPD780033AYGK |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | 8位單晶片微控制器 |
| 文件頁(yè)數(shù)： | 61/70頁(yè) |
| 文件大小： | 527K |
| 代理商： | UPD780033AYGK |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)當(dāng)前第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)
61
μ
PD780031AY, 780032AY, 780033AY, 780034AY
Data Sheet U14045EJ1V0DS00
(2)
μ
PD780031AYGK-
×××
-8A8: 64-pin plastic LQFP (12
×
12 mm)
μ
PD780032AYGK-
×××
-8A8: 64-pin plastic LQFP (12
×
12 mm)
μ
PD780033AYGK-
×××
-8A8: 64-pin plastic LQFP (12
×
12 mm)
μ
PD780034AYGK-
×××
-8A8: 64-pin plastic LQFP (12
×
12 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
(at 210
°
C or higher),
Count: two times or less,
Exposure limit: 7 days
Note
(after that,
prebake at 125
°
C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max.
(at 200
°
C or higher),
Count: two times or less,
Exposure limit: 7 days
Note
(after that,
prebake at 125
°
C for 10 hours)
VP15-107-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max.,
Count: once, Preheating temperature: 120
°
C max. (package
surface temperature), Exposure limit: 7 days
Note
(after that, prebake
at 125
°
C for 10 hours
)
WS60-107-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
––
Note
After opening the dry pack, store it at 25
°
C or less and 65%RH or less for the allowable storage
period.
Caution Do not use different soldering methods together (except for partial heating).
Table 14-2. Insertion Type Soldering Conditions
μ
PD780031AYCW-
×××
: 64-pin plastic shrink DIP (750mils)
μ
PD780032AYCW-
×××
: 64-pin plastic shrink DIP (750mils)
μ
PD780033AYCW-
×××
: 64-pin plastic shrink DIP (750mils)
μ
PD780034AYCW-
×××
: 64-pin plastic shrink DIP (750mils)
Soldering Method
Soldering Conditions
Wave soldering
(only for pins)
Solder bath temperature: 260
°
C max., Time: 10 seconds max.
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with
the package.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPD780226 | MOS INTERGRATED CIRCUIT |
| UPD780226GF | MOS INTERGRATED CIRCUIT |
| UPD780226GF-xxx-3BA | MOS INTERGRATED CIRCUIT |
| UPD78233 | ADVANCED, 8 BIT REAL TIME CONTROL MICROCOMPUTERS WITH A/D AND D/A CONVERTERS |
| UPD78233GC-3B9 | ADVANCED, 8 BIT REAL TIME CONTROL MICROCOMPUTERS WITH A/D AND D/A CONVERTERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD780034AGC-119-8BS-A | 制造商:Renesas Electronics Corporation 功能描述:NECUPD780034AGC-119-8BS-A MCU |
| UPD780053GC-055-8BT-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780101MC-047-5A4-E1-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780102MC-082-5A4-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780102MC-083-5A4-A | 制造商:Renesas Electronics Corporation 功能描述: |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。