參數(shù)資料
型號: UPD780032AYGC
廠商: NEC Corp.
元件分類: 8位微控制器
英文描述: 8-BIT SINGLE-CHIP MICROCONTROLLERS
中文描述: 8位單晶片微控制器
文件頁數(shù): 60/70頁
文件大?。?/td> 527K
代理商: UPD780032AYGC
60
μ
PD780031AY, 780032AY, 780033AY, 780034AY
Data Sheet U14045EJ1V0DS00
14. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales represen-
tative.
Table 14-1. Surface Mounting Type Soldering Conditions
(1)
μ
PD780031AYGC-
×××
-AB8: 64-pin plastic QFP (14
×
14 mm)
μ
PD780032AYGC-
×××
-AB8: 64-pin plastic QFP (14
×
14 mm)
μ
PD780033AYGC-
×××
-AB8: 64-pin plastic QFP (14
×
14 mm)
μ
PD780034AYGC-
×××
-AB8: 64-pin plastic QFP (14
×
14 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
(at 210
°
C or higher), Count: three times or less
IR35-00-3
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max.
(at 200
°
C or higher), Count: three times or less
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max.,
Count: once, Preheating temperature: 120
°
C max. (package surface
temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
––
Caution Do not use different soldering methods together (except for partial heating).
相關PDF資料
PDF描述
UPD780032AYGK 8-BIT SINGLE-CHIP MICROCONTROLLERS
UPD780033AY 8-BIT SINGLE-CHIP MICROCONTROLLERS
UPD780033AYCW 8-BIT SINGLE-CHIP MICROCONTROLLERS
UPD780033AYGC 8-BIT SINGLE-CHIP MICROCONTROLLERS
UPD780033AYGK 8-BIT SINGLE-CHIP MICROCONTROLLERS
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