參數(shù)資料
型號： UPD780031AYCW(A)-XXX
元件分類： 微控制器/微處理器
英文描述： 8-BIT, MROM, 8.38 MHz, MICROCONTROLLER, PDIP64
封裝： 0.750 INCH, PLASTIC, SDIP-64
文件頁數(shù)： 83/94頁
文件大?。?/td> 682K
代理商： UPD780031AYCW(A)-XXX
84
PD780031A(A), 780032A(A), 780033A(A), 780034A(A), 780031AY(A), 780032AY(A), 780033AY(A), 780034AY(A)
Data Sheet U15132EJ2V0DS
Table 14-1. Surface Mounting Type Soldering Conditions (2/2)
(3)
PD780031AGK(A)-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780032AGK(A)-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780033AGK(A)-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780034AGK(A)-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds max.
IR35-107-2
(at 210
°C or higher), Count: Two times or less, Exposure limit:
7 daysNote (after that, prebake at 125
°C for 10 hours)
VPS
Package peak temperature: 215
°C, Time: 40 seconds max.
VP15-107-2
(at 200
°C or higher), Count: Two times or less, Exposure limit:
7 daysNote (after that, prebake at 125
°C for 10 hours)
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max.,
WS60-107-1
Count: Once, Preheating temperature: 120
°C Max. (package surface
temperature), Exposure limit: 7 daysNote (after that, prebake at 125
°C
for 10 hours)
Partial heating
Pin temperature: 300
°C max., Time: 3 seconds max. (per pin row)
—
Note
After opening the dry pack, store it at 25
°C or less and 65%RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Table 14-2. Insertion Type Soldering Conditions
PD780031ACW(A)-×××
×××
×××: 64-pin plastic SDIP (19.05 mm (750))
PD780032ACW(A)-×××
×××
×××: 64-pin plastic SDIP (19.05 mm (750))
PD780033ACW(A)-×××
×××
×××: 64-pin plastic SDIP (19.05 mm (750))
PD780034ACW(A)-×××
×××
×××: 64-pin plastic SDIP (19.05 mm (750))
Soldering Method
Soldering Conditions
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max.
(only for pins)
Partial heating
Pin temperature: 300
°C max., Time: 3 seconds max. (per pin row)
Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with
the package.
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