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參數(shù)資料
| 型號(hào)： | UPD75006 |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機(jī) |
| 文件頁(yè)數(shù)： | 61/66頁(yè) |
| 文件大小： | 542K |
| 代理商： | UPD75006 |
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μ
PD75004, 75006, 75008
61
13. RECOMMENDED SOLDERING CONDITIONS
It is recommended that
μ
PD75004, 75006, and 75008 be soldered under the following conditions.
For details on the recommended soldering conditions, refer to Information Document "Semiconductor
Devices Mounting Manual" (IEI-616).
The soldering methods and conditions are not listed here, consult NEC.
Table 13-1 Soldering Conditions
μ
PD75004GB - xxx - 3B4: 44-pin plastic QFP (
I
I
10 mm)
μ
PD75006GB - xxx - 3B4: 44-pin plastic QFP (
I
I
10 mm)
μ
PD75008GB - xxx - 3B4: 44-pin plastic QFP (
I
I
10 mm)
Soldering Method
Soldering Conditions
Infrared Reflow
Package peak temperature: 230
°
C, time: 30 seconds max.
(210
°
C min.), number of times: 1, number of days: 7 days*,
(afterwards, 10 hours of prebaking at 125
°
C is required.)
Package peak temperature: 215
°
C, time: 40 seconds max.
(200
°
C min.), number of times: 1, number of days: 7 days*,
(afterwards, 10 hours of prebaking at 125
°
C is required.)
Soldering bath temperature: 260
°
C max., time: 10 seconds
max., number of times: 1, number of days: 7 days*,
(afterwards, 10 hours of prebaking at 125
°
C is required.)
pre-heating temperature: 120
°
C max. (package surface
temperature)
Pin temperature: 300
°
C max.,
time: 3 seconds max. (per side)
IR30-107-1
VPS
VP15-107-1
Wave Soldering
WS60-00-1
Pin Partial Heating
—
*:
This means the number of days after unpacking the dry pack. Storage conditions are 25
°
C and 65%
RH max.
Caution: Do not use two or more soldering methods in combination (except the pin partial heating
method).
#
Table 13-2 Soldering Conditions of Through-Hole Type
μ
PD75004CU - xxx : 42-pin plastic shrink DIP (600 mil)
μ
PD75006CU - xxx : 42-pin plastic shrink DIP (600 mil)
μ
PD75008CU - xxx : 42-pin plastic shrink DIP (600 mil)
Symbol for Recommended
Condition
Soldering Method
Soldering Conditions
Wave Soldering
(Only for lead part)
Soldering bath temperature: 260
°
C max., Time: 10 seconds max.
Pin Partial Heating
Pin temperature: 260
°
C max., Time: 10 seconds max.
Notice
A model that can be soldered under the more stringent conditions (infrared reflow peak temperature:
235
°
C, number of times: 2, and an extended number of days) is also available.
For details, consult NEC.
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