參數(shù)資料
型號: UPD6708
廠商: NEC Corp.
英文描述: IEBusa Inter Equipment Busa PROTOCOL CONTROL LSI
中文描述: IEBusa設(shè)備布薩間協(xié)議控制大規(guī)模集成電路
文件頁數(shù): 69/72頁
文件大?。?/td> 292K
代理商: UPD6708
69
μ
PD6708
11. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document
Semiconductor Device Mounting
Technology Manual (IEI-1207)
.
For soldering methods and conditions other than those recommended, please contact NEC representative.
Table 11-1. Surface Mount Type Soldering Conditions
μ
PD6708GS : 16-pin plastic SOP (300 mil)
Caution
Use of more than one soldering method should be avoided (except for partial heating).
Table 11-2. Hole-Through Type Soldering Conditions
μ
PD6708CX : 16-pin plastic DIP (300mil)
Soldering Method
Soldering Conditions
Wave soldering
(pin only)
Solder temperature: 260
°
C or below, Flow time: 10 seconds or less
Partial heating
Pin temperature: 300
°
C or below, Flow time: 3 seconds or less (per pin)
Caution
Wave soldering is used on the pin only, and care must be taken to prevent solder from coming into direct
contact with the package body.
#
Soldering Method
Soldering Conditions
Symbol
Infrared ray reflow
Package peak temperature: 230
°
C, Reflow time: 30 seconds or less (at 210
°
C or
higher), Number of reflow processes: 1
IR30-00-1
VPS reflow
Package peak temperature: 215
°
C, Reflow time: 40 seconds or less (at 200
°
C or
higher), Number of reflow processes: 1
VP15-00-1
Partial heating
Pin temperature: 300
°
C or below, Flow time: 3 seconds or less (per side of device)
––
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UPD6708CX 制造商:NEC 制造商全稱:NEC 功能描述:IEBusa Inter Equipment Busa PROTOCOL CONTROL LSI
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