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參數(shù)資料
| 型號(hào)： | UPD6600AGS |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR REMOTE CONTROL TRANSMISSION |
| 中文描述： | 4位單片機(jī)的遙控傳輸 |
| 文件頁數(shù)： | 32/36頁 |
| 文件大?。?/td> | 172K |
| 代理商： | UPD6600AGS |
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μ
PD6124A, 6600A
32
25. RECOMMENDED SOLDERING CONDITIONS
It is recommended that
μ
PD6124A and 6600A be soldered under the following conditions.
For details on the recommended soldering conditions, refer to Information Document “
Semiconductor Device
Mounting Technology Manual
” (C10535E).
For other soldering methods and conditions, consult NEC.
Table 25-1. Soldering Conditions of Surface-Mount Type
μ
PD6124AGS-XXX: 20-pin plastic SOP (300 mil)
μ
PD6600AGS-XXX: 20-pin plastic SOP (300 mil)
Symbol for
Soldering Method
Soldering Conditions
Recommended Condition
Infrared Reflow
Package peak temperature: 230
°
C, time: 30 seconds max. (210
°
C min.), number of times: 1
IR30-00-1
VPS
Package peak temperature: 215
°
C, time: 40 seconds max. (200
°
C min.), number of times: 1
VP15-00-1
Wave Soldering
Soldering bath temperature: 260
°
C max., time: 10 seconds max., number of times: 1
Pre-heating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Partial Heating
Pin temperature: 300
°
C max., time: 3 seconds max. (per side)
–
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
Table 25-2. Soldering Conditions of Through-Hole Type
μ
PD6124ACS-XXX: 20-pin plastic shrink DIP (300 mil)
μ
PD6600ACS-XXX: 20-pin plastic shrink DIP (300 mil)
Soldering Method
Soldering Conditions
Wave Soldering (Only for pin part)
Soldering bath temperature: 260
°
C max., time: 10 seconds max.
Pin temperature: 300
°
C max., time: 30 seconds max.
Partial Heating
Caution
The wave soldering must be performed at the pin part only. Note that the solder must not be directly
contacted to the package body.
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