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參數(shù)資料
| 型號： | UPD63210LGT |
| 廠商： | NEC Corp. |
| 英文描述： | 16-BIT D/A CONVERTER WITH BUILT-IN DIGITAL FILTER FOR AUDIO |
| 中文描述： | 16位D /一個內(nèi)置轉(zhuǎn)換器，在數(shù)字的音頻過濾器 |
| 文件頁數(shù)： | 16/18頁 |
| 文件大?。?/td> | 141K |
| 代理商： | UPD63210LGT |
μ
PD63210, 63210L
16
7. RECOMMENDED SOLDERING CONDITIONS
The solder mounting of this product should be conducted under the following conditions. For details of the
recommended soldering conditions, please refer to the information document
“Semiconductor Device Mount-
ing Technology Manual” (C10535E)
.
For soldering methods and conditions other than those recommended, please contact an NEC salesperson.
Table 7-1. Soldering Conditions
μ
PD63210GT : 28-pin plastic SOP (375 mil)
μ
PD63210LGT : 28-pin plastic SOP (375 mil)
Caution Please avoid using two or more soldering methods at the same time (except for the pin part
heating method).
Soldering Method
Infrared reflow
VPS
Wave soldering
Pin part heating
Soldering Condition
Package peak temperature: 235
°
C; time: within 30 secs (at no lower than
210
°
C); count: twice
<Precautions>
(1) The second reflow should be started after the temperature of the
device, which would have changed due to the first reflow, has returned
to normal.
(2) Please avoid flux water washing after the first reflow.
Package peak temperature: 215
°
C; time: within 40 secs (at no lower than
200
°
C); count: once
<Precautions>
(1) The second reflow should be started after the temperature of the
device, which would have changed due to the first reflow, has returned
to normal.
(2) Please avoid flux water washing after the first reflow.
Solder bath temperature: no higher than 260
°
C, time: within 10 secs;
count: once
Preheating temperature: up to 120
°
C (package surface temperature)
Pin part temperature: no higher than 300
°
C; time: within 3 secs (per device
side)
Recommended
Condition Symbol
IR35-00-2
VP15-00-2
WS60-00-1
-
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