參數(shù)資料
型號(hào)： UPD31172F1-48-FN
元件分類： 外設(shè)及接口
英文描述： MULTIFUNCTION PERIPHERAL, PBGA208
封裝： 15 X 15 MM, PLASTIC, FBGA-208
文件頁(yè)數(shù)： 33/44頁(yè)
文件大小： 279K
代理商： UPD31172F1-48-FN
Data Sheet U14388EJ2V0DS00
39
PD31172
4. RECOMMENDED SOLDERING CONDITIONS
The
PD31172 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 4-1. Surface Mounting Type Soldering Conditions
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Three times or less, Exposure limit: 7 days
Note (after that, prebake at 125°C for
10 to 72 hours)
IR35-107-3
VPS
Package peak temperature: 215°C, Time: 25 to 40 seconds (at 200°C or higher),
Count: Three times or less, Exposure limit: 7 days
Note (after that, prebake at 125°C for
10 to 72 hours)
VP15-107-3
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
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