參數(shù)資料
型號: UPD17242UC-XXX-5A4
元件分類: 微控制器/微處理器
英文描述: 4-BIT, MROM, 4.5 MHz, MICROCONTROLLER, PDSO30
封裝: 0.300 INCH, PLASTIC, SSOP-30
文件頁數(shù): 99/102頁
文件大?。?/td> 953K
代理商: UPD17242UC-XXX-5A4
96
Data Sheet U15002EJ1V1DS
PD17240, 17241, 17242, 17243, 17244, 17245, 17246
17. RECOMMENDED SOLDERING CONDITIONS
The
PD17240, 17241, 17242, 17243, 17244, 17245, and 17246 should be soldered and mounted under the
following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 17-1. Surface Mounting Type Soldering Conditions
(1)
PD17240MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
PD17241MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
PD17242MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
PD17243MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
PD17244MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
PD17245MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
PD17246MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
Recommended Condition
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds max.
IR35-00-3
(at 210
°C or higher), Count: Three times or less
VPS
Package peak temperature: 215
°C, Time: 40 seconds max.
VP15-00-3
(at 200
°C or higher), Count: Three times or less
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max., Count: Once, WS60-00-1
Preheating temperature: 120
°C max. (package surface temperature)
Partial heating
Pin temperature: 350
°C max., Time: 3 seconds max. (per pin row)
(2)
PD17240MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
PD17241MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
PD17242MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
PD17243MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
PD17244MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
PD17245MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
PD17246MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))
Recommended Condition
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 260
°C, Time: 60 seconds max.
IR60-103-3
(at 220
°C or higher), Count: Three times or less, Exposure limit: 3 daysNote
(after that, prebake at 125
°C for 10 to 72 hours)
Wave soldering
For details, contact an NEC Electronics sales representative.
Partial heating
Pin temperature: 350
°C max., Time: 3 seconds max. (per pin row)
Note
After opening the dry pack, store it at 25
°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remark
Products that have the part numbers suffixed by “-A” are lead-free products.
相關(guān)PDF資料
PDF描述
UPD178F054 78K/0 Series for Instructions | User's Manual[10/2001]
UPD178F124 78K/0 Series for Instructions | User's Manual[10/2001]
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