參數(shù)資料
型號(hào)： UDA1344
廠商： NXP Semiconductors N.V.
元件分類： Codec
英文描述： Low-voltage low-power stereo audio CODEC with DSP features
中文描述： 低電壓低功耗立體聲音頻編解碼器與數(shù)字信號(hào)處理功能
文件頁(yè)數(shù)： 24/28頁(yè)
文件大小： 126K
代理商： UDA1344
2000 Feb 04
24
Philips Semiconductors
Preliminary specification
Low-voltage low-power stereo audio
CODEC with DSP features
UDA1344TS
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UDA1344TS 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Low-voltage low-power stereo audio CODEC with DSP features
UDA1344TS/N2 制造商:NXP Semiconductors 功能描述:IC CODEC AUDIO W/DSP 28-SSOP 制造商:NXP Semiconductors 功能描述:IC, CODEC, AUDIO, W/DSP, 28-SSOP
UDA1344TS/N2,512 功能描述:接口—CODEC AUDIO CODEC W/DSP RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel
UDA1344TS/N2,518 功能描述:接口—CODEC AUDIO CODEC-LO VOLT RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel
UDA1344TSDB 功能描述:接口—CODEC AUDIO CODEC W/DSP RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel
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