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參數(shù)資料
| 型號： | TXN132204015A45 |
| 廠商： | INTEL CORP |
| 元件分類： | 光收發(fā) |
| 英文描述： | FIBER OPTIC TRANSCEIVER, TRANSPONDER, 1530-1565nm, 10000Mbps(Tx), 10000Mbps(Rx), MU CONNECTOR |
| 封裝： | ROHS COMPLIANT, PACKAGE-300 |
| 文件頁數(shù)： | 51/52頁 |
| 文件大?。?/td> | 1394K |
| 代理商： | TXN132204015A45 |
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Intel TXN13220/1/4/5/7/8 SFF 10 Gbps Optical Transceiver
Intel TXN13220/1/4/5/7/8 SFF 10 Gbps Optical Transceiver
Datasheet
26-Oct-2006
8
Order Number: 273807004
1.0
Introduction
This section discusses the following topics:
1.1
Product Overview
The Intel TXN13220/7/8 10 Gbps, Multiple-Rate Optical SerDes Transceiver with
16-Channel Multiplexer/Demultiplexer multi-rate line of 10 Gbps SerDes transceivers
(called hereafter the TXN13220/1/4/5/7/8 Transceiver) is designed to provide a
SONET/SDH, 10 GbE, or FEC interface between the physical layer and the electrical
layer. The TXN13220/1/4/5/7/8 Transceiver comprises an optical transmitter and
receiver pair, integrated with electrical multiplex and demultiplex functions.
As shown in the Figure 1 block diagram, the TXN13220/1/4/5/7/8 Transceiver
transmitter section multiplexes 16 channels from a differential LVDS parallel data bus
into a 10 Gbps optical signal launched into a single-mode, optical-fiber pigtail. The
transmitter contains a miniature packaged integrated driver with a semi-cooled
1310 nm DFB laser or a cooled 1550 nm EML.
The receiver operates over both the 1.3 m and 1.5 m bands and is compliant with
SONET/SDH OC-192/STM-64 physical layer specifications and Draft 5.0 of IEEE*
802.3ae 10GBASE-L and 10GBASE-E 10 GbE specifications. The rate at which the
TXN13220/1/4/5/7/8 Transceiver operates is digitally selectable. The receiver includes
a PIN photodiode and transimpedance amplifier, which operate over both the 1.3 μm
and 1.5 μm bands.
The TXN13220/1/4/5/7/8 Transceiver is assembled in a multi-source agreement (MSA)
compatible package with dimensions 3.0" L × 2.2" W × 0.53" H. The heatsink was
designed for 55 °C ambient temperature/250 linear feet per minute airflow. Alternative
heatsink options (for example, 0.63", 0.7" and 0.43” flat top) are also available upon
request.
The LVDS interface connection is made using an MSA-compliant, 300-pin, Berg
MEG-Array* connector with standard pinout. Optical connections are made with
standard SC-UPC or LC-UPC optical connectors. Other optical connection options may
be available upon request.
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