參數(shù)資料
型號: TWR-ELEV
廠商: Freescale Semiconductor
文件頁數(shù): 5/48頁
文件大?。?/td> 0K
描述: TOWER ELEVATOR BOARDS HARDWARE
其它有關(guān)文件: TWR-ELEV Dummy Schematic
TWR-ELEV Functional Schematic
產(chǎn)品培訓(xùn)模塊: MCF51CN Family - Ultimate Ethernet Solutions
Tower System
特色產(chǎn)品: The Tower System
標(biāo)準(zhǔn)包裝: 1
系列: ColdFire®
附件類型: 2 個升降機(jī)板
適用于相關(guān)產(chǎn)品: Freescale 電源塔系統(tǒng)
產(chǎn)品目錄頁面: 734 (CN2011-ZH PDF)
相關(guān)產(chǎn)品: TWR-SER-ND - TOWER SERIAL I/O HARDWARE
TWR-MCF51CN-ND - KIT TOWER BOARD
TWR-MCF51CN-KIT-ND - KIT TOWER BOARD/SERIAL/ELEVATOR
Electrical Characteristics
MCF51CN128 ColdFire Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
13
3.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take PI/O into account in power calculations, determine
the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. 1
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected)
is:
PD = K ÷ (TJ + 273°C)
Eqn. 2
Solving Equation 1 and Equation 2 for K gives:
K = PD × (TA + 273°C) + θJA × (PD)
2
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving Equation 1 and Equation 2 iteratively
for any value of TA.
Table 5. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range
(packaged)
TA
TL to TH
(–40 to 85 or 0 to 70)1
1 Depending on device.
°C
Maximum junction temperature
TJM
95
°C
Thermal resistance
Single-layer board
48-pin QFN
θ
JA
81
°C/W
64-pin LQFP
69
80-pin LQFP
60
Thermal resistance
Four-layer board
48-pin QFN
θ
JA
26
°C/W
64-pin LQFP
50
80-pin LQFP
47
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TWR-ELEV 制造商:Freescale Semiconductor 功能描述:Tower System - Elevator Boards
TWR-FRAM 功能描述:存儲器 IC 開發(fā)工具 Freescale Tower FRAM Daughter Card RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Reference Boards 工具用于評估:M24LR64-R 存儲容量:64 kbit 存儲類型:EEPROM 工作電源電壓:1.8 V to 5.5 V
TWR-HW 功能描述:WIRELESS RELAY 120/277 HARD WIRE 制造商:thomas research products 系列:ZenNet 零件狀態(tài):過期 配件類型:無線繼電器 配套使用產(chǎn)品/相關(guān)產(chǎn)品:* 標(biāo)準(zhǔn)包裝:1
TWR-IND-IO 功能描述:界面開發(fā)工具 IND CTRL Tower IO RoHS:否 制造商:Bourns 產(chǎn)品:Evaluation Boards 類型:RS-485 工具用于評估:ADM3485E 接口類型:RS-485 工作電源電壓:3.3 V
TWR-K20D50M 功能描述:開發(fā)板和工具包 - ARM PK20DX128VLH5 EvBrd RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V