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參數(shù)資料
| 型號： | TSSOP-56 |
| 廠商： | Fairchild Semiconductor Corporation |
| 英文描述： | Fairchild Semiconductor Product Package Material Disclosure |
| 中文描述： | 費(fèi)爾柴爾德半導(dǎo)體產(chǎn)品包裝材料披露 |
| 文件頁數(shù)： | 1/1頁 |
| 文件大?。?/td> | 92K |
| 代理商： | TSSOP-56 |
Fairchild Semiconductor Product Package Material Disclosure
Materials Disclosure Disclaimer
The information provided in this Materials Disclosure is, to our knowledge, correct. However, there is no guarantee to completeness
or accuracy, as some information is derived from data sources outside the company. Also, there may not be information included in
this statement regarding the minute amounts of dopant and metal materials contained
within the electrically active or passive devices
contained within the finished product.
Package Type
Weight of
Package (grams)
Component
TSSOP-56
Maximum
Minimum
2.21E-01
2.08E-01
Material
Weight in
grams
Substance in
material
Wt% in
finished
product min
33.34
32.08
1.00
0.22
0.05
0.00
58.07
35.92
0.00
8.98
0.30
Wt% in
finished
product max
35.41
33.66
1.06
0.23
0.05
0.40
61.66
47.89
0.90
20.65
1.80
CAS #
Copper
Nickel
Silicon
Magnesium
Silver (DP)
Silica
Carbon Black
Resin
Antimony
Compound
Brominated
Compound
Tin
Lead
Tin
Silicon and trace
metals
Silver
Resin
Gold
7440-50-8
7439-89-6
7440-66-6
7439-95-4
7440-22-4
1309-64-4
Lead Frame
Copper alloy
7.37E-02
0.90
2.39
68541-56-0
Encapsulation
Epoxy
1.28E-01
1.37
1.17
0.21
1.37
1.37
0.84
0.84
6.87
5.84
1.03
6.87
6.87
0.93
0.93
7440-31-5
7439-92-1
7440-31-5
7440-21-3
Solder
8.84E-03
Plating
or
Lead-free
Solder
8.84E-03
Chip
Silicon and
inorganic
compounds
1.90E-03
0.10
0.07
0.02
0.62
0.62
0.11
0.08
0.03
0.68
0.68
7440-22-4
7440-57-5
Die Attach
Adhesive
2.22E-04
Wire Bond
Gold Wire
1.39E-03
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