參數(shù)資料
型號: TSPC860SRMZPU40D4
廠商: E2V TECHNOLOGIES PLC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 40 MHz, RISC PROCESSOR, PBGA357
封裝: PLASTIC, BGA-357
文件頁數(shù): 22/90頁
文件大小: 2351K
代理商: TSPC860SRMZPU40D4
29
TSPC860
2129A–HIREL–08/02
Scope
This drawing describes the specific requirements for the microcontroller TSPC860, in
compliance with MIL-STD-883 class Q or Atmel standard screening.
Applicable
Documents
1.
MIL-STD-883: Test methods and procedures for electronics.
2.
MIL-PRF-38535 appendix A: General specifications for microcircuits.
Requirements
General
The microcircuits are in accordance with the applicable documents and as specified
herein.
Design and Construction
Terminal Connections
The terminal connections shall be as shown in the general description.
Lead Material and Finish
Lead material and finish shall be as specified on page 87.
Package
The macrocircuits are packaged in 357-lead Plastic Ball Grid Array (BGA) packages.
The precise case outlines are described at the end of the specification.
IP_B3/IWP2/VF2
IP_B3: high impedance
IWP2: high
VF2: low
IP_B4/LWP0/VF0
IP_B4: high impedance
LWP0: high
VF0: low
IP_B5/LWP1/VF1
IP_B5: high impedance
LWP1: high;
VF1: low
Table 3. Signal States during Hardware Reset (Continued)
Signal
Behavior
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