![](http://datasheet.mmic.net.cn/130000/TSC2301IPAGR_datasheet_5023238/TSC2301IPAGR_88.png)
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TSC2301IGQZ
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GQZ
120
250
TBD
SNPB
Level-2A-235C-4 WKS
TSC2301IGQZR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GQZ
120
2500
TBD
SNPB
Level-2A-235C-4 WKS
TSC2301IPAG
ACTIVE
TQFP
PAG
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
TSC2301IPAGG4
ACTIVE
TQFP
PAG
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
TSC2301IPAGR
ACTIVE
TQFP
PAG
64
1500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
TSC2301IPAGRG4
ACTIVE
TQFP
PAG
64
1500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
TSC2301IZQZ
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQZ
120
250
Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
TSC2301IZQZR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQZ
120
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2007
Addendum-Page 1